XX |
Family Descriptor |
28 = FLASH29 = Single Supply Flash memory29K = LightFlash50 = Flash memory for PC BIOS29D = Dual or Multiple Bank Flash |
X |
Operating Voltage |
F = 5VW = 2.7V to 3.6VV = Low-voltageFLW = Firmware Hub/Low pin count interface, Vcc=2.7V to 3.6VLPW = Low pin count interface, Vcc=2.7V to 3.6V |
XXX |
Density |
004, 004B = 512kx8008, 008A = 1Mx8010B = 128kx8, Uniform block017D = 2Mx8, Uniform block022B = 256kx8040, 040B = 512kx8, Uniform block102B = 64kx16160B, 160D, 160E = 2Mx8 / 1Mx16200B = 256kx8 / 128kx16320D, 320E = 4Mx8 / 2Mx16400, 400B, 400D, 400F = 512kx8 / 256kx16512B = 64kx8640D, 640F, 640G, 064F = 8Mx8 / 4Mx16641D = 4Mx16, Uniform block800, 800A, 800D = 1Mx8 / 512kx16128F, 128G = 16Mx8 / 8Mx16, Uniform block256G = 32Mx8 / 16Mx16, Uniform block640GS = 64Mbit (x8/x16), boot block, uniform or boot block, secure flash memory |
X |
Boot Block Architecture |
T = Top Boot BlockB = Bottom Boot BlockH = Protection on highest address blockL = Protection on lowest address block |
XX |
Speed Option |
55, 5A = 55 ns60 = 60 ns70, 7A = 70 ns80 = 80 ns90 = 90 ns100 = 100 ns120 = 120 ns |
X |
Power Supplies |
Blank = Vcc +/-10%, Vpp +/-5%X = Vcc +/-5%, Vpp +/-5%Y = Vcc +/-10%, Vpp +/-10% |
X |
Package Type |
P = Plastic DIPN, NA = TSOP40, TSOP48NB = TSOP56K = PLCCZA, ZB, ZF = TBGA, TFBGA, LFBGAZS = LBGA, FBGAM = PSOPB = Plastic DIP32C = PLCC32NZ = TSOP32 |
X |
Temperature Range |
0, 1 = 0°C to 70°C3 = -40°C to 125°C5 = -20°C to 85°C6 = -40°C to 85°C |
XX |
Option |
T, S = Tape & ReelR = Reverse pinoutBlank = Standard packingE = Lead-free package, Standard packingF = Lead-free package, Tape & Reel packing |