Device: NAND02GW3B2CN [TSOP48]
Manufacturer: Numonyx
Part number description for this device:
|
NAND
XXX
X
X
X
X
XX
X
X
|
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NAND |
NAND Flash Memory |
|
XXX |
Density |
128 = 128Mbit256 = 256Mbit512 = 512Mbit01G = 1Gbit02G = 2Gbit04G = 4Gbit08G = 8Gbit16G = 16Gbit32G = 32Gbit64G = 64Gbit |
X |
Operating Voltage |
R = Vdd=1.7V to 1.95VW = Vdd=2.7V to 3.6V |
X |
Bus Width |
3 = x84 = x16 |
X |
Family Identifier |
A = 512+16 Bytes page, SLCB = 2048+64 Bytes page, SLCC = 2048+64 Bytes page, MLCD = 4096+128 Bytes page, MLCF = 4096+128 Bytes page, SLC |
X |
Product Version |
A = First versionB = Second versionC = Third versionD = Fourth vesionS = Fifth version |
XX |
Package Type |
N = TSOP48 (12x20mm)V = USOP48 (12x17x0.65mm)ZA = VFBGA55 (8x10x1mm, 6x8 ball array, 0.8mm pitch)ZA = VFBGA63 (9x11x1mm, 6x8 ball array, 0.8mm pitch)ZB = TFBGA63 (9.5x12x1.2mm, 6x8 ball array, 0.8mm pitch)ZC = LFBGA63 (9.5x12x1.4mm, 6x8 ball array, 0.8mm pitch)ZL = LGA52 (12x17mm) |
X |
Temperature Range |
1 = 0°C to 70°C6 = -40°C to 85°C |
X |
Option |
Blank = Standard packingT = Tape&Reel packingE = Lead-free package, trayF = Lead-free package, Tape&Reel packing |
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.
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