Universal | Production | Device | Programmers | Adapters | Elnec
show-menu
0 items | view cart Elnec online orders

Device: R5F101LDxBG [FLGA64]

Manufacturer: Renesas

Part number description for this device:

Move the cursor over the box to highlight particular section
R Renesas Semiconductor Product  
X Device Type 5 = MCU
X Memory Type F = Flash memory
XXX Group 100 = RL78/G13, Data flash is provided101 = RL78/G13, Data flash is not provided102 = RL78/G12, Data flash is provided103 = RL78/G12, Data flash is not provided104 = RL78/G14105 = RL78/G11107 = RL78/I1A109 = RL78/F12110 = RL78/L1C, products with USB111 = RL78/L1C, products without USB113 = RL78/F1510A = RL78/F1310B = RL78/F1310C = RL78/D1A10D = RL78/D1A10E = RL78/G1A10J = RL78/G1C, USB host/function controller mounted10K = RL78/G1C, USB function controller mounted10P = RL78/F1410R = RL78/L1210W = RL78/L1310Y = RL78/G10117 = RL78/I1D11A = RL78/G1D11B = RL78/G1F11C = RL78/I1E11E = RL78/G1D11F = RL78/G1H11M = RL78/L1A
X Pin Count 1 = 10-pin4 = 16-pin6 = 20-pin7 = 24-pin8 = 25-pin or 20 to 30-pin for RL78/G1AA = 30-pinB = 32-pinC = 36-pinD = 38-pinE = 40-pinF = 44-pinG = 48-pinJ = 52-pinL = 64-pinM = 80-pinN = 85-pinP = 100-pinS = 128-pin
X ROM Capacity 6 = 2KB7 = 4KB8 = 8KB9 = 12KBA = 16KBC = 32KBD = 48KBE = 64KBF = 96KBG = 128KBH = 192KBJ = 256KBK = 384KBL = 512KB
X Bonding Wire Material Blank = Au wire bonding productsC = Cu wire bonding products
X Classification A = Consumer applications, operating ambient temperature -40°C to 85°CD, J = Industrial applications, operating ambient temperature -40°C to 85°CG, L = Industrial applications, operating ambient temperature -40°C to 105°CK, M = Industrial applications, operating ambient temperature -40°C to 125°CY = Industrial applications, operating ambient temperature -40°C to +150°C
XXX ROM Number - Omitted with blank product
XX Package Type BG = FBGA, 0,40mm pitch or TFBGA, 0.50mm pitchFA = LQFP, 0,65mm pitchFB = LQFP, LFQFP, 0,50mm pitchFP = LQFP, 0,80mm pitchLA = LGA, VFLGA, WFLGA, 0,50mm or 0.65mm pitchNA = WQFN, HVQFN, 0.50mm pitchNB = WQFN, HWQFN, 0,40mm pitchSP = SSOP, 0,65mm pitch
#XX Packaging Specification #30 = Tray (LFQFP)#30 = Tray (LFQFP, LQFP, LSSOP, SSOP), Tube (LSSOP)#50 = Embosed Tape (LFQFP, LQFP, LSSOP, SSOP)#U0 = Tray (VFLGA)#V0 = Tray (SSOP)#W0 = Embossed Tape (VFLGA)#X0 = Embossed Tape (SSOP)

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

go back to result page

Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: BGA-2877/2878 (70-2877/2878) = BGA-Bottom-290 (70-2877) + BGA-Top-308 ZIF-CS (70-2878) =
BeeHive208S adapter/module: BGA-2877/2878 (70-2877/2878) = BGA-Bottom-290 (70-2877) + BGA-Top-308 ZIF-CS (70-2878) =
BeeHive304 adapter/module: AP3 BGA64-6 CS R5F-2 (73-3821)
BeeProg2 adapter/module: BGA-2877/2878 (70-2877/2878) = BGA-Bottom-290 (70-2877) + BGA-Top-308 ZIF-CS (70-2878) =
BeeProg2C adapter/module: BGA-2877/2878 (70-2877/2878) = BGA-Bottom-290 (70-2877) + BGA-Top-308 ZIF-CS (70-2878) =
BeeProg3 adapter/module: AP3 BGA64-6 CS R5F-2 (73-3821)
go back to result page
🍪
Back to TOP