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Device: R5F10PLGCxFB [LQFP64 10x10]

Manufacturer: Renesas

Part number description for this device:

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R Renesas Semiconductor Product  
X Device Type 5 = MCU
X Memory Type F = Flash memory
XXX Group 100 = RL78/G13, Data flash is provided101 = RL78/G13, Data flash is not provided102 = RL78/G12, Data flash is provided103 = RL78/G12, Data flash is not provided104 = RL78/G14105 = RL78/G11107 = RL78/I1A109 = RL78/F12110 = RL78/L1C, products with USB111 = RL78/L1C, products without USB113 = RL78/F1510A = RL78/F1310B = RL78/F1310C = RL78/D1A10D = RL78/D1A10E = RL78/G1A10J = RL78/G1C, USB host/function controller mounted10K = RL78/G1C, USB function controller mounted10P = RL78/F1410R = RL78/L1210W = RL78/L1310Y = RL78/G10117 = RL78/I1D11A = RL78/G1D11B = RL78/G1F11C = RL78/I1E11E = RL78/G1D11F = RL78/G1H11M = RL78/L1A
X Pin Count 1 = 10-pin4 = 16-pin6 = 20-pin7 = 24-pin8 = 25-pin or 20 to 30-pin for RL78/G1AA = 30-pinB = 32-pinC = 36-pinD = 38-pinE = 40-pinF = 44-pinG = 48-pinJ = 52-pinL = 64-pinM = 80-pinN = 85-pinP = 100-pinS = 128-pin
X ROM Capacity 6 = 2KB7 = 4KB8 = 8KB9 = 12KBA = 16KBC = 32KBD = 48KBE = 64KBF = 96KBG = 128KBH = 192KBJ = 256KBK = 384KBL = 512KB
X Bonding Wire Material Blank = Au wire bonding productsC = Cu wire bonding products
X Classification A = Consumer applications, operating ambient temperature -40°C to 85°CD, J = Industrial applications, operating ambient temperature -40°C to 85°CG, L = Industrial applications, operating ambient temperature -40°C to 105°CK, M = Industrial applications, operating ambient temperature -40°C to 125°CY = Industrial applications, operating ambient temperature -40°C to +150°C
XXX ROM Number - Omitted with blank product
XX Package Type BG = FBGA, 0,40mm pitch or TFBGA, 0.50mm pitchFA = LQFP, 0,65mm pitchFB = LQFP, LFQFP, 0,50mm pitchFP = LQFP, 0,80mm pitchLA = LGA, VFLGA, WFLGA, 0,50mm or 0.65mm pitchNA = WQFN, HVQFN, 0.50mm pitchNB = WQFN, HWQFN, 0,40mm pitchSP = SSOP, 0,65mm pitch
#XX Packaging Specification #30 = Tray (LFQFP)#30 = Tray (LFQFP, LQFP, LSSOP, SSOP), Tube (LSSOP)#50 = Embosed Tape (LFQFP, LQFP, LSSOP, SSOP)#U0 = Tray (VFLGA)#V0 = Tray (SSOP)#W0 = Embossed Tape (VFLGA)#X0 = Embossed Tape (SSOP)

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: DIL48/LQFP64-2 ZIF R5F-3 (70-2604)
BeeHive204AP adapter/module: AP1 LQFP64-2 ZIF R5F-3 (71-4453)
BeeHive208S adapter/module: DIL48/LQFP64-2 ZIF R5F-3 (70-2604)
BeeHive304 adapter/module: AP3 QFP64-1.02 R5F-1 (73-3756)
BeeProg2 adapter/module: DIL48/LQFP64-2 ZIF R5F-3 (70-2604)
BeeProg2AP adapter/module: AP1 LQFP64-2 ZIF R5F-3 (71-4453)
BeeProg2C adapter/module: DIL48/LQFP64-2 ZIF R5F-3 (70-2604)
BeeProg3 adapter/module: AP3 QFP64-1.02 R5F-1 (73-3756)
BeeHive204AP-AU (discontinued) adapter/module: AP1 LQFP64-2 ZIF R5F-3 (71-4453)
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