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Device: 28C256

Manufacturer: SEEQ

Part number description for this device:

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X Package Type D = CerDIPN = PLCCP = Plastic DIPUX = Unencapsulated DIEL = LCCS = SOIC
X Temperature Range M = MilitaryE = ExtendedQ = Commercial
XX Family Descriptor 28, 55 = EEPROM
X Technology Blank = NMOSC = CMOSHC = High Speed CMOS
XX Density 16A = 2kx864 = 8kx8010 = 128kx8256, 256A = 32kx8
X EEPROM Byte Write Time Blank = 10 msH = 2 ms
XXX Access Time 150 = 150 ns200 = 200 ns250 = 250 ns300 = 300 ns
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X Screening Option B = MIL883 Class B screened

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 direct connection
BeeHive208S direct connection
BeeProg2 direct connection
BeeProg2C direct connection
SmartProg2 direct connection
MEMprog2 (discontinued) direct connection
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