Device: H26M78003BFR [FBGA169]
Manufacturer: SK Hynix
Part number description: |
X X X X XX X X X X X X |
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X | Hynix | |
X | Product Family | 2 = Flash |
X | Product Mode | 6 = e-NAND |
X | Interface | M = MMC |
XX | e-NAND Multi-type | 1x = Density: 1GB3x = Density: 4GB4x = Density: 8GB5x = Density: 16GB6x = Density: 32GB7x = Density: 64GB21 = Density: 2GB, NAND class: MLCx1, Vcc=2.7V to 3.6V,Vccq=1.8V or 2.7V to 3.6V |
X | NAND Multi-type | 0None |
X | DRAM Multi-type | 0None |
X | MCU Version | 1 = 1st generation |
X | e-NAND Generation | E = 6th generation |
X | Package Type | A = FBGA (169ball) 12x16x1.3C = FBGA (153ball) 11.5x13x1.2F = FBGA (169ball) 12x16x1.2Q = FBGA (169ball) 12x16x1.0K = FBGA (169ball) 14x18x1.2M = FBGA (153ball) 11.5x13x1.0N = FBGA (169ball) 14x18x1.4P = FBGA (153ball) 11.5x13x0.8 |
X | Package Material | R = Lead&halogen free |
Supported by programmers and programming adapters/modules:
BeeHive204 | adapter/module: BGA-Bottom-165 (70-1009) + BGA-Top-193 ZIF-CS (a) (70-1010A) OR BGA-Bottom-165 (70-1009) + BGA-Top-299 ZIF (a) (70-2811A) |
BeeHive204AP | adapter/module: AP1 BGA169-1.01 eMMC-1 (71-3193) |
BeeHive208S | adapter/module: BGA-Bottom-165 (70-1009) + BGA-Top-193 ZIF-CS (a) (70-1010A) OR BGA-Bottom-165 (70-1009) + BGA-Top-299 ZIF (a) (70-2811A) |
BeeHive304 | adapter/module: AP3 BGA169-1.01 eMMC-1 (73-3043) |
BeeProg2 | adapter/module: BGA-Bottom-165 (70-1009) + BGA-Top-193 ZIF-CS (a) (70-1010A) OR BGA-Bottom-165 (70-1009) + BGA-Top-299 ZIF (a) (70-2811A) |
BeeProg2AP | adapter/module: AP1 BGA169-1.01 eMMC-1 (71-3193) |
BeeProg2C | adapter/module: BGA-Bottom-165 (70-1009) + BGA-Top-193 ZIF-CS (a) (70-1010A) OR BGA-Bottom-165 (70-1009) + BGA-Top-299 ZIF (a) (70-2811A) |
BeeProg3 | adapter/module: AP3 BGA169-1.01 eMMC-1 (73-3043) |
BeeHive204AP-AU (discontinued) | adapter/module: AP1 BGA169-1.01 eMMC-1 (71-3193) |
BeeProg+ (discontinued) | adapter/module: BGA-Bottom-165 (70-1009) + BGA-Top-193 ZIF-CS (a) (70-1010A) OR BGA-Bottom-165 (70-1009) + BGA-Top-299 ZIF (a) (70-2811A) |