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Device: M30L0R7000B0 [TFBGA88]

Manufacturer: STMicroelectronics

Part number description for this device:

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M30 Device Type M30 = Multiple Flash memory product
X Flash 1 Architecture L = Multiple-Level, Multiple bank, Burst modeW = Multiple bank, burst mode
X Flash 2 Architecture 0No other architecture
X Operating Voltage R = Vdd=Vddq=1.8V typical
X Flash 1 Density 7 = 128Mbit8 = 256Mbit
X Flash 2 Density 0No die
X Flash 3 Density 0No die
X Flash 4 Density 0No die
X Parameter Block Location T = Top boot blockB = Bottom boot block
X Product Version 2 = 90nm technology multilevel design1 = 0.13um technology
XXX Package Type ZAQ = TFBGA88, 8x10mm, 0.80mm pitch, quadruple stacked footprint
X Option Blank = Standard packingT = Tape&Reel packingE = Lead-free and RoHS package, standard packingF = Lead-free and RoHS package, Tape&Reel packing

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: BGA-0386/0336 (70-0386/0336) = BGA-Bottom-16 (70-0386) + BGA-Top-29 ZIF (70-0336)
BeeHive204AP adapter/module: AP1 BGA-0386/0336 (71-2124)
BeeHive208S adapter/module: BGA-0386/0336 (70-0386/0336) = BGA-Bottom-16 (70-0386) + BGA-Top-29 ZIF (70-0336)
BeeProg2 adapter/module: BGA-0386/0336 (70-0386/0336) = BGA-Bottom-16 (70-0386) + BGA-Top-29 ZIF (70-0336)
BeeProg2AP adapter/module: AP1 BGA-0386/0336 (71-2124)
BeeProg2C adapter/module: BGA-0386/0336 (70-0386/0336) = BGA-Bottom-16 (70-0386) + BGA-Top-29 ZIF (70-0336)
BeeHive204AP-AU (discontinued) adapter/module: AP1 BGA-0386/0336 (71-2124)
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