Device: M30L0R8000B2 [TFBGA88] (BEFP)
Manufacturer: STMicroelectronics
Device type: FLASH
Part number description: |
M30 X X X X X X X X X XXX X |
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M30 | Device Type | M30 = Multiple Flash memory product |
X | Flash 1 Architecture | L = Multiple-Level, Multiple bank, Burst modeW = Multiple bank, burst mode |
X | Flash 2 Architecture | 0No other architecture |
X | Operating Voltage | R = Vdd=Vddq=1.8V typical |
X | Flash 1 Density | 7 = 128Mbit8 = 256Mbit |
X | Flash 2 Density | 0No die |
X | Flash 3 Density | 0No die |
X | Flash 4 Density | 0No die |
X | Parameter Block Location | T = Top boot blockB = Bottom boot block |
X | Product Version | 2 = 90nm technology multilevel design1 = 0.13um technology |
XXX | Package Type | ZAQ = TFBGA88, 8x10mm, 0.80mm pitch, quadruple stacked footprint |
X | Option | Blank = Standard packingT = Tape&Reel packingE = Lead-free and RoHS package, standard packingF = Lead-free and RoHS package, Tape&Reel packing |
Supported by programmers and programming adapters/modules:
BeeHive204 | adapter/module: BGA-0385/0336 (70-0385/0336) = BGA-Bottom-15 (70-0385) + BGA-Top-29 ZIF (70-0336) |
BeeHive204AP | adapter/module: AP1 BGA-0385/0336 (71-2125) |
BeeHive208S | adapter/module: BGA-0385/0336 (70-0385/0336) = BGA-Bottom-15 (70-0385) + BGA-Top-29 ZIF (70-0336) |
BeeProg2 | adapter/module: BGA-0385/0336 (70-0385/0336) = BGA-Bottom-15 (70-0385) + BGA-Top-29 ZIF (70-0336) |
BeeProg2AP | adapter/module: AP1 BGA-0385/0336 (71-2125) |
BeeProg2C | adapter/module: BGA-0385/0336 (70-0385/0336) = BGA-Bottom-15 (70-0385) + BGA-Top-29 ZIF (70-0336) |
BeeHive204AP-AU (discontinued) | adapter/module: AP1 BGA-0385/0336 (71-2125) |
BeeProg+ (discontinued) | adapter/module: BGA-0385/0336 (70-0385/0336) = BGA-Bottom-15 (70-0385) + BGA-Top-29 ZIF (70-0336) |