BeeProg2

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Device: M30L0R8000B2 [TFBGA88] (BEFP)

Manufacturer: STMicroelectronics

Device type: FLASH

Part number description:	M30 X X X X X X X X X XXX X
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M30	Device Type	M30 = Multiple Flash memory product
X	Flash 1 Architecture	L = Multiple-Level, Multiple bank, Burst mode W = Multiple bank, burst mode
X	Flash 2 Architecture	0No other architecture
X	Operating Voltage	R = Vdd=Vddq=1.8V typical
X	Flash 1 Density	7 = 128Mbit 8 = 256Mbit
X	Flash 2 Density	0No die
X	Flash 3 Density	0No die
X	Flash 4 Density	0No die
X	Parameter Block Location	T = Top boot block B = Bottom boot block
X	Product Version	2 = 90nm technology multilevel design 1 = 0.13um technology
XXX	Package Type	ZAQ = TFBGA88, 8x10mm, 0.80mm pitch, quadruple stacked footprint
X	Option	Blank = Standard packing T = Tape&Reel packing E = Lead-free and RoHS package, standard packing F = Lead-free and RoHS package, Tape&Reel packing

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Supported by programmers and programming adapters/modules:

BeeHive204	adapter/module: BGA-0385/0336 (70-0385/0336) = BGA-Bottom-15 (70-0385) + BGA-Top-29 ZIF (70-0336)
BeeHive204AP	adapter/module: AP1 BGA-0385/0336 (71-2125)
BeeHive208S	adapter/module: BGA-0385/0336 (70-0385/0336) = BGA-Bottom-15 (70-0385) + BGA-Top-29 ZIF (70-0336)
BeeProg2	adapter/module: BGA-0385/0336 (70-0385/0336) = BGA-Bottom-15 (70-0385) + BGA-Top-29 ZIF (70-0336)
BeeProg2AP	adapter/module: AP1 BGA-0385/0336 (71-2125)
BeeProg2C	adapter/module: BGA-0385/0336 (70-0385/0336) = BGA-Bottom-15 (70-0385) + BGA-Top-29 ZIF (70-0336)
BeeHive204AP-AU (discontinued)	adapter/module: AP1 BGA-0385/0336 (71-2125)
BeeProg+ (discontinued)	adapter/module: BGA-0385/0336 (70-0385/0336) = BGA-Bottom-15 (70-0385) + BGA-Top-29 ZIF (70-0336)

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exhibitions

okraj

NEPCON South China 2020

26th - 28th Aug 2020
Shenzhen Convention & Exhibition Center, China
booth no.: 9C06
exhibitor: Prosystems

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