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Device: M36L0R7040T0 [TFBGA88]

Manufacturer: STMicroelectronics

Part number description for this device:

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M36 Device Type M36 = MultiChip package (Multiple Flash + RAM)
X Flash 1 Architecture A = Single bank, Boot blockL = Multi-Level, Multiple bank, Burst modeW = Multiple Bank, Burst ModeC = Single bank, Boot blockP = Multi-level, multi bank, large buffer
X Flash 2 Architecture 0No dieL = Multi-Level, Multiple bank, Burst mode
X Operating Voltage R = Vddf=Vccp=Vddq=1.7 to 1.95VT = Vddf=1.7 to 2V, Vddq=Vddp=2.7 to 3.3VW = Vddf=Vccp=2.7V to 3.3V
X Flash 1 Density 5 = 32Mbit6 = 64Mbit7 = 128Mbit8 = 256Mbit9 = 512Mbit
X Flash 2 Density 0No die7 = 128Mbit8 = 256Mbit
X RAM 1 Density 2 = 4Mbit3 = 8Mbit4 = 16Mbit5 = 32Mbit6 = 64Mbit
X RAM 0 Density 0No die
X Parameter Blocks Location T, U = Top boot block flashB, L = Bottom boot block flashD = Mixed (Flash 1 bottom, Flash 2 top)M = Mixed (Flash 1 top, Flash 2 bottom)N = Even block flash memory configuration, Mux I/OE = Even block flash memory configuration
X Product Version Blank00.13um Flash technology, 70ns speed00.13um Flash technology, 70ns; 0.18um RAM, 85ns speed00.13um Flash technology, 70ns; 0.13um RAM, 70ns speed00.13um Flash technology, 70ns; 0.15um RAM, 70ns speed00.18um technology PSRAM, 60ns speed090nm flash technology, 96ns speed, 0.11um PSRAM, 70ns speed090nm flash technology, 96ns speed, 0.11um PSRAM, 80ns speed1 = 0.13um Flash technology, 85ns speed; 0.11um PSRAM,70ns speed, burst mode1 = 90nm Flash technology, 70ns; 0.13um RAM, 70ns speed2 = 90nm Flash technology Multilevel Design, 85ns speed;0.13um RAM, 65ns speed3 = 90nm Flash technology, 70ns speed, RAM, Mux I/O4 = 65 nm flash technology, 70ns speed, RAM, 70ns speed, mux I/O5 = 65nm flash technology, 70ns speed, exteded OTP,RAM technology: 70ns, mux I/O8 = 90nm Flash technology Multilevel Design, 85ns speed;0.11um PSRAM, 70ns speed, burst mode9 = 65 nm flash technology multilevel design, 70 and 85 ns speed;0.11 µm PSRAM, 70 ns speed, burst mode
XXX Package Type ZAQ = Stacked TFBGA88/LFBGA88, 8x10mm active ball array, 0.8mm pitchZAI = Stacked LFBGA66, 12x8mm - 8x8 active ball array, 0.8mm pitchZAC, ZAN = Stacked TFBGA107, C stacked footprintZAM = Stacked TFBGA88, 8x10mm, 8x10 active ball array, 0.8mm pitchZSP = Stacked TFBGA56, 7x9mm, 56 ball array, 0.8mm pitchZS = Stacked TFBGA56, 8x6mm, 10x6 active ball array, 0.50mm pitch
X Option Blank = Standard packingT = Tape&Reel packingE = Lead-free and RoHS standard packingF = Lead-free and RoHS Tape&Reel packing

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: BGA-0385/0336 (70-0385/0336) = BGA-Bottom-15 (70-0385) + BGA-Top-29 ZIF (70-0336)
BeeHive204AP adapter/module: AP1 BGA-0385/0336 (71-2125)
BeeHive208S adapter/module: BGA-0385/0336 (70-0385/0336) = BGA-Bottom-15 (70-0385) + BGA-Top-29 ZIF (70-0336)
BeeProg2 adapter/module: BGA-0385/0336 (70-0385/0336) = BGA-Bottom-15 (70-0385) + BGA-Top-29 ZIF (70-0336)
BeeProg2AP adapter/module: AP1 BGA-0385/0336 (71-2125)
BeeProg2C adapter/module: BGA-0385/0336 (70-0385/0336) = BGA-Bottom-15 (70-0385) + BGA-Top-29 ZIF (70-0336)
BeeHive204AP-AU (discontinued) adapter/module: AP1 BGA-0385/0336 (71-2125)
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