| M36 |
Device Type |
M36 = MultiChip package (Multiple Flash + RAM) |
| X |
Flash 1 Architecture |
A = Single bank, Boot blockL = Multi-Level, Multiple bank, Burst modeW = Multiple Bank, Burst ModeC = Single bank, Boot blockP = Multi-level, multi bank, large buffer |
| X |
Flash 2 Architecture |
0No dieL = Multi-Level, Multiple bank, Burst mode |
| X |
Operating Voltage |
R = Vddf=Vccp=Vddq=1.7 to 1.95VT = Vddf=1.7 to 2V, Vddq=Vddp=2.7 to 3.3VW = Vddf=Vccp=2.7V to 3.3V |
| X |
Flash 1 Density |
5 = 32Mbit6 = 64Mbit7 = 128Mbit8 = 256Mbit9 = 512Mbit |
| X |
Flash 2 Density |
0No die7 = 128Mbit8 = 256Mbit |
| X |
RAM 1 Density |
2 = 4Mbit3 = 8Mbit4 = 16Mbit5 = 32Mbit6 = 64Mbit |
| X |
RAM 0 Density |
0No die |
| X |
Parameter Blocks Location |
T, U = Top boot block flashB, L = Bottom boot block flashD = Mixed (Flash 1 bottom, Flash 2 top)M = Mixed (Flash 1 top, Flash 2 bottom)N = Even block flash memory configuration, Mux I/OE = Even block flash memory configuration |
| X |
Product Version |
Blank00.13um Flash technology, 70ns speed00.13um Flash technology, 70ns; 0.18um RAM, 85ns speed00.13um Flash technology, 70ns; 0.13um RAM, 70ns speed00.13um Flash technology, 70ns; 0.15um RAM, 70ns speed00.18um technology PSRAM, 60ns speed090nm flash technology, 96ns speed, 0.11um PSRAM, 70ns speed090nm flash technology, 96ns speed, 0.11um PSRAM, 80ns speed1 = 0.13um Flash technology, 85ns speed; 0.11um PSRAM,70ns speed, burst mode1 = 90nm Flash technology, 70ns; 0.13um RAM, 70ns speed2 = 90nm Flash technology Multilevel Design, 85ns speed;0.13um RAM, 65ns speed3 = 90nm Flash technology, 70ns speed, RAM, Mux I/O4 = 65 nm flash technology, 70ns speed, RAM, 70ns speed, mux I/O5 = 65nm flash technology, 70ns speed, exteded OTP,RAM technology: 70ns, mux I/O8 = 90nm Flash technology Multilevel Design, 85ns speed;0.11um PSRAM, 70ns speed, burst mode9 = 65 nm flash technology multilevel design, 70 a |
| XXX |
Package Type |
ZAQ = Stacked TFBGA88/LFBGA88, 8x10mm active ball array, 0.8mm pitchZAI = Stacked LFBGA66, 12x8mm - 8x8 active ball array, 0.8mm pitchZAC, ZAN = Stacked TFBGA107, C stacked footprintZAM = Stacked TFBGA88, 8x10mm, 8x10 active ball array, 0.8mm pitchZSP = Stacked TFBGA56, 7x9mm, 56 ball array, 0.8mm pitchZS = Stacked TFBGA56, 8x6mm, 10x6 active ball array, 0.50mm pitch |
| X |
Option |
Blank = Standard packingT = Tape&Reel packingE = Lead-free and RoHS standard packingF = Lead-free and RoHS Tape&Reel packing |
