| M58 |
Device Type |
|
| X |
Architecture |
L = Multilevel, multiple bank, burst mode |
| X |
Operating Voltage |
T = Vdd=1.7V to 2.0V, Vddq=2.7V to 3.6VR = Vdd=Vddq=1.7V to 2.0V |
| XXX |
Density |
128 = 128Mbit (8Mx16)256 = 256Mbit (16Mx16) |
| X |
Technology |
G = 0.13umH = 90nmJ = 90nm, multilevel designK = 65nm |
| X |
Security |
BlankS = Security |
| X |
Parameter Location |
T = Top bootB = Bottom bootU = Top boot, Mux I/OL = Bottom boot, Mux I/OC = Top boot, mux I/OD = Bottom boot, mux I/O |
| X |
Speed |
8 = 80ns1 = 110ns85 = 85ns90 = 90ns70 = 70ns76 = 70ns, 66MHz speed class78 = 70ns, 86MHz speed class |
| XX |
Package Type |
ZA = TFBGA44, 7.5x5mm, 0.5mm pitch (M58LRxxxKC/D only)ZA = TBGA64, 10x13mm, 1mm pitchZA = TFBGA88, 8x10mm, 0.8mm pitch (M58LRxxxKT/B only)ZB = VFBGA44, 7.7x9mm, 0.50mm pitch (M58LR128GU/L only)ZB = VFBGA56ZB = VFBGA56, 7.7 x 9 mm, 0.75 mm pitch (M58LRxxxKT/B only)ZC = VFBGA44, 8x10mm, 0.50mm pitch (M58LR256GU/L only)ZC = VFBGA79, 9 x 11 mm, 0.75 mm pitch (M58LRxxxKT/B only) |
| X |
Temperature Range |
5 = -25°C to 85°C6 = -40°C to 85°C |
| X |
Packing Option |
BlankT = Tape and reel packingE = Leed-free package, standard packingF = Lead-free package, Tape&Reel packing, 24mm |
