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Device: M58PR256LE [TFBGA105]

Manufacturer: STMicroelectronics

Part number description for this device:

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M58 Device Type  
X Architecture P = multilevel, multiple bank, large buffer
X Operating Voltage R = Vdd=1.7V to 2.0V, Vddq=1.7V to 2.0V
XXX Density 256 = 256Mbit512 = 512Mbit001 = 1Gbit
X Technology L = 65nm technology multilevel design
X Memory Organization E = Uniform blocks
XX Speed 96 = 96ns
XXX Package Type ZAD = Stacked TFBGA105 D stacked footprintZAC = Stacked TFBGA107 C stacked footprint
X Temperature Range 5 = -30°C to 85°C

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: BGA-1045/1036 (70-1045/1036) = BGA-Bottom-170 (70-1045) + BGA-Top-65 ZIF (70-1036)
BeeHive204AP adapter/module: AP1 BGA-1045/1036 (71-2035)
BeeHive208S adapter/module: BGA-1045/1036 (70-1045/1036) = BGA-Bottom-170 (70-1045) + BGA-Top-65 ZIF (70-1036)
BeeProg2 adapter/module: BGA-1045/1036 (70-1045/1036) = BGA-Bottom-170 (70-1045) + BGA-Top-65 ZIF (70-1036)
BeeProg2AP adapter/module: AP1 BGA-1045/1036 (71-2035)
BeeProg2C adapter/module: BGA-1045/1036 (70-1045/1036) = BGA-Bottom-170 (70-1045) + BGA-Top-65 ZIF (70-1036)
BeeHive204AP-AU (discontinued) adapter/module: AP1 BGA-1045/1036 (71-2035)
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