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Device: K522H1HACG [FBGA130] (EPS-1)

Manufacturer: Samsung

Part number description for this device:

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K5 Samsung MCP (2 chips)  
X Device Type 1 = NAND flash + mobile SDR2 = NAND flash + mobile DDR
XX NAND Flash Density, Organisation 1F = 1Gbit, x81H = 1Gbit, x162F = 2Gbit, x82H = 2Gbit, x164G = 4Gbit, x16
XX RAM Density, Organisation 12 = 512Mbit, x1616 = 512Mbit, x321H = 1Gbit, x162G = 2Gbit, x3257 = 256Mbit, x1658 = 256Mbit, x32
X Operating Voltage A = 1.8V / 1.8V
X Flash Block Architecture C = Uniform block
X Version M = 1st generationA = 2nd generationB = 3rd generationC = 4th generationetc.
X Package Type A, B = FBGA (HF, OSP LF)
X NAND Flash Speed 0None
XX RAM Speed 50 = 5.0ns (200MHz@CL3)60 = 6.0ns (166MHz@CL3)75 = 7.5ns (133MHz@CL3)

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: DIL48/BGA130-1 ZIF NAND-1 (70-3176) Support of this chip is restricted to some programmer[s] only. Contact manufacturer of programmer for details.
BeeHive208S adapter/module: DIL48/BGA130-1 ZIF NAND-1 (70-3176) Support of this chip is restricted to some programmer[s] only. Contact manufacturer of programmer for details.
BeeProg2 adapter/module: DIL48/BGA130-1 ZIF NAND-1 (70-3176) Support of this chip is restricted to some programmer[s] only. Contact manufacturer of programmer for details.
BeeProg2C adapter/module: DIL48/BGA130-1 ZIF NAND-1 (70-3176) Support of this chip is restricted to some programmer[s] only. Contact manufacturer of programmer for details.
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