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Device: K9F1G08U0C [TSOP48]

Manufacturer: Samsung

Part number description for this device:

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K Device Type K = Memory
9 Family Descriptor 9 = NAND Flash
X Small Classification 1 = SLC 1 Chip XD Card2 = SLC 2 Chip XD Card3 = 4bit MLC Mono4 = SLC 4 Chip XD Card5 = MLC 1 chip XD card6 = MLC 2 chip XD card7 = SLC moviNAND8 = MLC moviNAND9 = 4bit MLC ODPA = 3bit MLC MONOB = 3bit MLC DDPC = 3bit MLC QDPE = SLC Dual (S/B)F = SLC NormalG = MLC NormalH = MLC QDPJ = Non-muxed One NandK = SLC Die Normal, SLC Die stackL = MLC DDPM = MLC DSPN = SLC DSPO = 3bit MLC ODPP = MLC ODPQ = SLC ODPR = MLC 12-die stackS = MLC 6-die stackT = SLC Single (S/B)U = MLC 16-die stackW = SLC 4 Die StackNote:SLC = Single Level CellMLC = Multi Level CellSM = SmartMediaS/B = Small Block
XX Density 00 = None40 = 4Mbit80 = 8Mbit16 = 16Mbit32 = 32Mbit64 = 64Mbit28 = 128Mbit56 = 256Mbit12 = 512Mbit1G = 1Gbit2G = 2Gbit4G = 4Gbit8G = 8GbitAG = 16GbitLG = 24GbitBG = 32GbitZG = 48GbitCG = 64GbitNG = 96GbitDG = 128GbitEG, FG = 256GbitGG = 384GbitHG = 512Gbit
X Technology 0Normal (x8)1 = Normal (x16)C = Catridge SIPD = DDRM = moviNANDN = moviNAND FABP = moviMCPT = Premium eSSDZ = SSD
X Organization 0None6 = x168 = x8
X Supply Voltage 0NoneA = 1.65V to 3.6VB = 2.5V to 2.9VC = 4.5V to 5.5VD = 2.4V to 2.9VE = 2.3V to 3.6VR = 1.65V to 1.95VQ = 1.7V to 1.95VS = 3,0V to 3,6V / Vccq 1,65V to 1,95VT = 2.4V to 3.0VU = 2.7V to 3.6VV = 3.0V to 3.6VW = 2.7V to 5.5V, 3.0V to 5.5V
X Mode 0Normal1 = Dual nCE & Dual R/nB3 = Tri nCE & Tri R/nB4 = Quad nCE & Single R/nB5 = Quad nCE & Quad R/nB6 = 6 nCE & 2 RnB7 = 8 nCE & 4 RnB8 = 8 nCE & 2RnB9 = 1st block OTPA = Mask Option 1L = Low grade
X Generation M = 1st generationA = 2nd generationB = 3rd generationC = 4th generationD = 5th generationE = 6th generation...Y = 25th generationZ = 26th generation
X Package Type 8 = TSOP1 (Leed-free, halogen-free, CU)9 = 56TSOP1 (Lead-free, halogen-free, CU)A = COBB = FBGA (Lead-free, halogen-free)D = 63-TBGAE = ISM (Lead-free, halogen-free)F = WSOP (Lead-free)G = FBGAH = BGA (Lead-free, halogen-free)I = ULGA (Lead-free) (12*17)J = FBGA (Lead-free)K = ULGA (Lead-free, halogen-free) (12*17)L = ULGA (Lead-free, halogen-free) (14*18)M = 52-ULGA (Lead-free, halogen-free) (13*18)P = TSOP1 (Lead-free)Q = TSOP2 (Lead-free)R = 56-TSOP1 (Lead-free, halogen-free)S = TSOP1 (Lead-free, halogen-free)T = WSOP (Lead-free, halogen-free)U = COB (MMC)V = WSOPW = WaferY = TSOP1Z = WELP (Lead-free)
X Temperature Range C = CommercialI = IndustrialS = SmartMediaB = SmartMedia BLUE0None
X Customer Bad Block B = Include bad blockD = Daisychain sampleK = Special handlingL = 1 to 5 bad blockN = Ini. all good, add. 10 blocksS = All good block0None (containing wafer, chip, BIZ, exception handling code)
X Pre-Program Version 0NoneSerial (1~9, A~Z)
X Packing T = Tape&Reel0Other (Tray, Tube, Jar)S = Stack
XX Customer („customer list reference“)  

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: DIL48/TSOP48 ZIF 18.4mm NAND-3 (70-3081)
BeeHive204AP adapter/module: AP1 TSOP48 ZIF 18.4mm NAND-3 (71-3097)
BeeHive208S adapter/module: DIL48/TSOP48 ZIF 18.4mm NAND-3 (70-3081)
BeeHive304 adapter/module: AP3 TSOP48-18.4mm NAND (73-2948)
BeeProg2 adapter/module: DIL48/TSOP48 ZIF 18.4mm NAND-3 (70-3081)
BeeProg2AP adapter/module: AP1 TSOP48 ZIF 18.4mm NAND-3 (71-3097)
BeeProg2C adapter/module: DIL48/TSOP48 ZIF 18.4mm NAND-3 (70-3081)
BeeProg3 adapter/module: AP3 TSOP48-18.4mm NAND (73-2948)
BeeHive204AP-AU (discontinued) adapter/module: AP1 TSOP48 ZIF 18.4mm NAND-3 (71-3097)
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