K |
Device Type |
K = Memory |
9 |
Family Descriptor |
9 = NAND Flash |
X |
Small Classification |
1 = SLC 1 Chip XD Card2 = SLC 2 Chip XD Card3 = 4bit MLC Mono4 = SLC 4 Chip XD Card5 = MLC 1 chip XD card6 = MLC 2 chip XD card7 = SLC moviNAND8 = MLC moviNAND9 = 4bit MLC ODPA = 3bit MLC MONOB = 3bit MLC DDPC = 3bit MLC QDPE = SLC Dual (S/B)F = SLC NormalG = MLC NormalH = MLC QDPJ = Non-muxed One NandK = SLC Die Normal, SLC Die stackL = MLC DDPM = MLC DSPN = SLC DSPO = 3bit MLC ODPP = MLC ODPQ = SLC ODPR = MLC 12-die stackS = MLC 6-die stackT = SLC Single (S/B)U = MLC 16-die stackW = SLC 4 Die StackNote:SLC = Single Level CellMLC = Multi Level CellSM = SmartMediaS/B = Small Block |
XX |
Density |
00 = None40 = 4Mbit80 = 8Mbit16 = 16Mbit32 = 32Mbit64 = 64Mbit28 = 128Mbit56 = 256Mbit12 = 512Mbit1G = 1Gbit2G = 2Gbit4G = 4Gbit8G = 8GbitAG = 16GbitLG = 24GbitBG = 32GbitZG = 48GbitCG = 64GbitNG = 96GbitDG = 128GbitEG, FG = 256GbitGG = 384GbitHG = 512Gbit |
X |
Technology |
0Normal (x8)1 = Normal (x16)C = Catridge SIPD = DDRM = moviNANDN = moviNAND FABP = moviMCPT = Premium eSSDZ = SSD |
X |
Organization |
0None6 = x168 = x8 |
X |
Supply Voltage |
0NoneA = 1.65V to 3.6VB = 2.5V to 2.9VC = 4.5V to 5.5VD = 2.4V to 2.9VE = 2.3V to 3.6VR = 1.65V to 1.95VQ = 1.7V to 1.95VS = 3,0V to 3,6V / Vccq 1,65V to 1,95VT = 2.4V to 3.0VU = 2.7V to 3.6VV = 3.0V to 3.6VW = 2.7V to 5.5V, 3.0V to 5.5V |
X |
Mode |
0Normal1 = Dual nCE & Dual R/nB3 = Tri nCE & Tri R/nB4 = Quad nCE & Single R/nB5 = Quad nCE & Quad R/nB6 = 6 nCE & 2 RnB7 = 8 nCE & 4 RnB8 = 8 nCE & 2RnB9 = 1st block OTPA = Mask Option 1L = Low grade |
X |
Generation |
M = 1st generationA = 2nd generationB = 3rd generationC = 4th generationD = 5th generationE = 6th generation...Y = 25th generationZ = 26th generation |
X |
Package Type |
8 = TSOP1 (Leed-free, halogen-free, CU)9 = 56TSOP1 (Lead-free, halogen-free, CU)A = COBB = FBGA (Lead-free, halogen-free)D = 63-TBGAE = ISM (Lead-free, halogen-free)F = WSOP (Lead-free)G = FBGAH = BGA (Lead-free, halogen-free)I = ULGA (Lead-free) (12*17)J = FBGA (Lead-free)K = ULGA (Lead-free, halogen-free) (12*17)L = ULGA (Lead-free, halogen-free) (14*18)M = 52-ULGA (Lead-free, halogen-free) (13*18)P = TSOP1 (Lead-free)Q = TSOP2 (Lead-free)R = 56-TSOP1 (Lead-free, halogen-free)S = TSOP1 (Lead-free, halogen-free)T = WSOP (Lead-free, halogen-free)U = COB (MMC)V = WSOPW = WaferY = TSOP1Z = WELP (Lead-free) |
X |
Temperature Range |
C = CommercialI = IndustrialS = SmartMediaB = SmartMedia BLUE0None |
X |
Customer Bad Block |
B = Include bad blockD = Daisychain sampleK = Special handlingL = 1 to 5 bad blockN = Ini. all good, add. 10 blocksS = All good block0None (containing wafer, chip, BIZ, exception handling code) |
X |
Pre-Program Version |
0NoneSerial (1~9, A~Z) |
X |
Packing |
T = Tape&Reel0Other (Tray, Tube, Jar)S = Stack |
XX |
Customer („customer list reference“) |
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