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Device: KBE00F005A [FBGA137]

Manufacturer: Samsung

Part number description for this device:

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KB Samsung MCP(4 chip) Memory  
X Small Classification A = Mi NOR+Mi NOR+UtRAM+SRAMB = NOR+NOR+NAND+UtRAMC = NAND+UtRAM+UtRAM+SRAMD = NOR+NAND+SDRAM+SDRAME = NAND+NAND+SDRAM+SDRAMF = NOR+NOR+UtRAM+UtRAMG = NOR+NOR+OneNAND+UtRAMH = NOR+OneNAND+UtRAM+UtRAMJ = NOR+OneNAND+OneNAND+UtRAMK = NOR+NOR+NOR+OneNANDL = I NOR+I NOR+NAND+NANDM = NOR+NOR+OneNAND+SDRAMN = OneNAND+OneNAND+SDRAM+SDRAMP = NAND+OneNAND+SDRAM+SDRAMR = OneNAND+OneNAND+OneNAND+SDRAMS = NOR+OneNAND+OneNAND+SDRAM
XX NOR Flash Density & Vcc & Org. & BB 00 = None01 = 64M*2, Vcc=3.0V, x16, Bank: 4/4/28/28, Bottom boot block02 = 64M*2, Vcc=3.0V, x16, Bank: 4/4/28/28, Top boot block03 = 64M*2, Vcc=3.0V, x16, Bank: 4/4/28/28, Bottom/Top boot block04 = 64M*2, Vcc=3.0V, x16, Bank: 4/4/28/28, Top/Bottom boot block05 = 64M*2, Vcc=3.0V, x8/x16, Bank: 48/16,48/16, Bottom boot block06 = 64M*2, Vcc=3.0V, x8/x16, Bank: 16/48,16/48, Top boot block07 = 64M, Vcc=3.0V, x16, Bank: 16/48, Bottom boot block08 = 128M*2, Vcc=1.8V, Vccq=1.8V, x16, Bank:8Mb*16*2, Bottom boot block09 = 128M*2, Vcc=1.8V, Vccq=1.8V, x16, Bank: 8Mb*16*2, Top boot block10 = 256M, Vcc=1.8V, Vccq=1.8V, x16 burst, Bank: 16Mb*16, Top boot block11 = 256M, Vcc=1.8V, Vccq=1.8V, x16 burst, Bank: 16Mb*16, Bottom boot block12 = 256M*2, Vcc=1.8V, Vccq=1.8V, x16 burst, Bank: 16Mb*16, Top boot block13 = 256M*2, Vcc=1.8V, Vccq=1.8V, x16 burst, Bank: 16Mb*16, Bottom boot block15 = Intel 256M*2, Vcc=1.8V, Vccq=1.8V, x16 burst, Bank: 16Mb*16, Bottom/Top boot block16 = 256M, Vcc=1.8V, Vccq=1.8V, x16, Bank: 16Mb*16, Top boot block17 = 256M, Vcc=1.8V, Vccq=1.8V, x16, Bank: 16Mb*16, Bottom boot block18 = 256M*3, Vcc=1.8V, Vccq=1.8V, x16, Bank: 16Mb*16, Bottom/Top/Top boot block19 = 256M*3, Vcc=1.8V, Vccq=1.8V, x16 muxed, Bank: 16Mb*16, Bottom/Top/Bottom boot block20 = 256M*2, Vcc=1.8V, Vccq=1.8V, x16, Bank: 16Mb*16, Botom/Top boot block21 = 128M, Vcc=1.8V, Vccq=1.8V, x16, Bank: 16Mb*16 muxed, Top boot block
X NAND Flash Density & Vcc & Org. 0NoneA = 128M, Vcc=3.0V, Vccq=3.0V, x16B = 256M, Vcc=3.0V, Vccq=3.0V, x16C = 256M*2, Vcc=3.0V, Vccq=3.0V, x16D = 256M*2, Vcc=1.8V, Vccq=1.8V, x16E = 512M One, Vcc=1.8V, Vccq=1.8V, x16F = 512M*2, Vcc=2.65V, Vccq=2.65V, x8H = 1G*2, Vcc=1.8V, Vccq=1.8V, x8G = 512M*2, Vcc=1.8V, Vccq=1.8V, x8J = 512M*2, Vcc=3.0V, Vccq=3.0V, x8K = 512M One*2, Vcc=1.8V, Vccq=1.8V, x16L = 256M*2, Vcc=3.0V, Vccq=3.0V, x8M = 256M*2, Vcc=2.65V, Vccq=2.65V, x16N = 512M*2, Vcc=1.8V, Vccq=1.8V, x8P = 1G, Vcc=1.8V, Vccq=1.8V, x8R = 512M One, Vcc=1.8V, Vccq=1.8V, x16, MuxedS = 1G*2, Vcc=2.65V, Vccq=2.65V, x8, SBT = 1G, Vcc=1.8V, Vccq=1.8V, x16, MuxedU = 1G*2, Vcc=3.0V, Vccq=3.0V, x16, 1CSV = 1G OneNAND*2, Vcc=1.8V, Vccq=1.8V, x16W = 512M NAND+1G OneNAND, Vcc=1.8V, Vccq=1.8V, x8/x16X = 512 NAND + 512M OneNAND, Vcc=1.8V, Vccq=1.8V, x8/x16Y = 1G OneNAND*3, Vcc=1.8V, Vccq=1.8V, x16
X UtRAM Density & Vcc & Org. 0None1 = 32M, Vcc=3.0V, Vccq=3.0V, x163 = 32M, Vcc=3.0V, Vccq=3.0V, x16, Page4 = 64M, Vcc=3.0V, Vccq=3.0V, x165 = 64M, Vcc=3.0V, Vccq=3.0V, x16, Page6 = 64M+32M, Vcc=3.0V, Vccq=3.0V, x167 = 64M*2, Vcc=3.0V, Vccq=3.0V, x16, Page8 = 64M*2, Vcc=2.6V, Vccq=1.8V, x16, Burst9 = 64M, Vcc=3.0V, Vccq=1.8V, x16A = 128M*2, Vcc=1.8V, Vccq=1.8V, x16, Burst, 2CSB = 128M, Vcc=1.8V, Vccq=1.8V, x16, BurstC = 128M, Vcc=1.8V, Vccq=1.8V, x16, BurstD = 128M*2, Vcc=1.8V, Vccq=1.8V, x16, Burst, 1CSE = 128M*2, Vcc=1.8V, Vccq=1.8V, x16, Page, 1CSZ = 64M, Vcc=3.0V, Vccq=3.0V, x16, PRAM
X SDRAM density & Vcc & Org. 0NoneA = 8M, Vcc=3.0V, x16
X DRAM I/F Density & Vcc & Org. 0None1 = SDRAM, 128M, Vcc=3.0V, Vccq=3.0V, x162 = SDRAM, 128M*2, Vcc=1.8V, Vccq=1.8V, x323 = SDRAM, 256M*2, Vcc=1.8V, Vccq=1.8V, x164 = MDDR, 256M*2, Vcc=1.8V, Vccq=1.8V, x32, 2CS5 = MSDR, 256M*2, Vcc=1.8V, Vccq=1.8V, x32, 2CS6 = MSDR, 256M*2, Vcc=3.0V, Vccq=3.0V, x167 = MDDR, 256M*2, Vcc=2.5V, Vccq=2.5V, x328 = MDDR, 512M, Vcc=1.8V, Vccq=1.8V, x169 = MSDR, 256M*2, Vcc=1.8V, Vccq=1.8V, x32, 1CS, 1CKA = MSDR, 512M*2, Vcc=1.8V, Vccq=1.8V, x32, 1CSB = MSDR, 256M*2, Vcc=2.5V, Vccq=2.5V, x32, 2CSC = MDDR, 512M*2, Vcc=1.8V, Vccq=1.8V, x32D = M-SDR, 512M*2, Vcc=1.8V, Vccq=1.8V, x32, 2CSE = M-SDR, 512M, Vcc=1.8V, Vccq=1.8V, x32F = SDRAM, 128M, Vcc=1.8V, Vccq=1.8V, x16
X Generation M = 1st generationA = 2nd generationB = 3rd generationC = 4th generationD = 5th generationE = 6th generationF = 7th generationG = 8th generation
X Package Type D = FBGA (Lead-free)E = LGA(No ball)F = FBGAG = LGA (Lead-free)P = FBGA (OSP)S = FBGA (OSP Lead-free)T = TBGA
XXX Speed 401 = 85ns, 85ns, 85ns, 55ns402 = 70ns, 70ns, 50ns, 70ns403 = 50ns, 70ns, 85ns, 55ns404 = 50ns, 70ns, 70ns, 70ns405 = 50ns, 70ns, 70ns, 55ns406 = 70ns, 50ns, 50ns, 10ns407 = 50ns, 50ns, 15ns, 15ns409 = 50ns, 50ns, 9.5ns, 9.5ns410 = 70ns, 70ns, 76ns, 70ns411 = 50ns, 50ns, 9ns, 9ns412 = 12ns, 50ns, 15ns, 15ns413 = 50ns, 50ns, 7.5ns, 7.5ns414 = 18.5ns, 18.5ns, 15ns, 15ns415 = 50ns, 50ns, 6ns, 6ns416 = 15ns, 18.5ns, 18.5ns, 15ns417 = 14ns, 14ns, 50ns, 50ns418 = 80ns, 70ns, 76ns, 70ns419 = 18.5ns, 18.5ns, 18.5ns, 18.5ns420 = 15ns, 15ns, 15ns, 15ns421 = 80ns, 70ns, 70ns, 70ns422 = 18.5ns, 18.5ns, 18.5ns, 9ns423 = 18.5ns, 18.5ns, 6ns, 6ns424 = 60ns, 18.5ns, 7.5ns, 7.5ns425 = 18.5ns, 18.5ns, 7.5ns, 7.5ns426 = 18.5ns, 18.5ns, 8.6ns, 8.6ns427 = 76ns, 76ns, 76ns, 9ns428 = 15ns, 18ns, 18ns, 7.5ns429 = 60ns, 60ns, 9ns, 9ns999 = Daisychain
X Packing Type T = Tape&ReelNumber = Other (Tray, Tube, Jar)S = Stack
XX Customer "Customer List Reference"  

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: BGA-0366/0367 (70-0366/0367) = BGA-Bottom-13 (70-0366) + BGA-Top-32 ZIF-CS (70-0367)
BeeHive208S adapter/module: BGA-0366/0367 (70-0366/0367) = BGA-Bottom-13 (70-0366) + BGA-Top-32 ZIF-CS (70-0367)
BeeProg2 adapter/module: BGA-0366/0367 (70-0366/0367) = BGA-Bottom-13 (70-0366) + BGA-Top-32 ZIF-CS (70-0367)
BeeProg2C adapter/module: BGA-0366/0367 (70-0366/0367) = BGA-Bottom-13 (70-0366) + BGA-Top-32 ZIF-CS (70-0367)
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