Device: SH8M08GAETCECxx01 [LFBGA100]
Manufacturer: Smart Modular
Part number description: |
SH 8 X XXX X X XX XX X X XXX |
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SH | SMART Modular | SH = Halogen-free |
8 | Integrated Memory Solution | |
X | Product Family | M = eMMC |
XXX | Device Density | 08G = 8GB16G = 16GB32G = 32GB |
X | Package Type | A = 100-ball 14.0x18.0C = 169-ball 12.0x16.0 |
X | Package Thickness | A = 1.0mmC = 1.2mmE = 1.4mm |
XX | NAND+MCU Configuration Code | TC = Toshiba 19mm 64Gb B-die + Phison PS8210DCAll others reserved |
XX | Firmware Base Code Version | EC = Standard 4.51 + FW v1All others reserved |
X | Shipping Media | A = TrayT = Tape & ReelAll others reserved |
X | Operating Temperature | E = Extended -25°C to 85°CI = Industrial -40°C to 85°CA = Automotive -40°C to 85°C plus additional testing |
XXX | Product Configuration | 01_ = Base configurationAll others reserved |
Supported by programmers and programming adapters/modules:
BeeHive204 | adapter/module: DIL48/BGA100-1.01 ZIF-CS eMMC-1 (70-3106) OR DIL48/BGA100-1.01 ZIF eMMC-2 (70-3347) |
BeeHive204AP | adapter/module: AP1 BGA100-1.02 ZIF eMMC-1 (71-6039) OR AP1 BGA100-1.01 eMMC-1 (discontinued) |
BeeHive208S | adapter/module: DIL48/BGA100-1.01 ZIF-CS eMMC-1 (70-3106) OR DIL48/BGA100-1.01 ZIF eMMC-2 (70-3347) |
BeeHive304 | adapter/module: AP3 BGA100-1.02 eMMC-1 (73-6024) OR AP3 BGA100-1.01 eMMC-1 (discontinued) |
BeeProg2 | adapter/module: DIL48/BGA100-1.01 ZIF-CS eMMC-1 (70-3106) OR DIL48/BGA100-1.01 ZIF eMMC-2 (70-3347) |
BeeProg2AP | adapter/module: AP1 BGA100-1.02 ZIF eMMC-1 (71-6039) OR AP1 BGA100-1.01 eMMC-1 (discontinued) |
BeeProg2C | adapter/module: DIL48/BGA100-1.01 ZIF-CS eMMC-1 (70-3106) OR DIL48/BGA100-1.01 ZIF eMMC-2 (70-3347) |
BeeProg3 | adapter/module: AP3 BGA100-1.02 eMMC-1 (73-6024) OR AP3 BGA100-1.01 eMMC-1 (discontinued) |
BeeHive204AP-AU (discontinued) | adapter/module: AP1 BGA100-1.02 ZIF eMMC-1 (71-6039) OR AP1 BGA100-1.01 eMMC-1 (discontinued) |