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Device: SH8M08GCATCECxx01 [VFBGA169]

Manufacturer: Smart Modular

Part number description for this device:

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SH SMART Modular SH = Halogen-free
8 Integrated Memory Solution  
X Product Family M = eMMC
XXX Device Density 08G = 8GB16G = 16GB32G = 32GB
X Package Type A = 100-ball 14.0x18.0C = 169-ball 12.0x16.0
X Package Thickness A = 1.0mmC = 1.2mmE = 1.4mm
XX NAND+MCU Configuration Code TC = Toshiba 19mm 64Gb B-die + Phison PS8210DCAll others reserved
XX Firmware Base Code Version EC = Standard 4.51 + FW v1All others reserved
X Shipping Media A = TrayT = Tape & ReelAll others reserved
X Operating Temperature E = Extended -25°C to 85°CI = Industrial -40°C to 85°CA = Automotive -40°C to 85°C plus additional testing
XXX Product Configuration 01_ = Base configurationAll others reserved

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: BGA-Bottom-165 (70-1009) BGA-Top-299 ZIF (a) (70-2811A)
BeeHive204AP adapter/module: AP1 BGA169-1.01 eMMC-1 (71-3193)
BeeHive208S adapter/module: BGA-Bottom-165 (70-1009) BGA-Top-299 ZIF (a) (70-2811A)
BeeHive304 adapter/module: AP3 BGA169-1.01 eMMC-1 (73-3043)
BeeProg2 adapter/module: BGA-Bottom-165 (70-1009) BGA-Top-299 ZIF (a) (70-2811A)
BeeProg2AP adapter/module: AP1 BGA169-1.01 eMMC-1 (71-3193)
BeeProg2C adapter/module: BGA-Bottom-165 (70-1009) BGA-Top-299 ZIF (a) (70-2811A)
BeeProg3 adapter/module: AP3 BGA169-1.01 eMMC-1 (73-3043)
BeeHive204AP-AU (discontinued) adapter/module: AP1 BGA169-1.01 eMMC-1 (71-3193)
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