Home » Device: 26HS512Txx00 [BGA24] Device: 26HS512Txx00 [BGA24] Manufacturer: Spansion Part number description for this device: S XX X X XXX X XX X X X XX X Move the cursor over the box to highlight particular section S Cypress XX Series 26 = Semper flash with hyperbus interface X Family H = High-performance serial X Voltage L = 3.0VS = 1.8V XXX Density 512 = 512Mb01G = 1Gb02G = 2Gb04G = 4Gb X Technology T = 45nm MirrorBit process technology XX Performance GA = 200 MHz DDRFP = 166MHz DDRFG = 133MHz DDR X Package Type B = 24 ball BGA, 1.0mm pitch X Package Material H = Halogen-free, lead(Pb)-free X Temperature Range I = Industrial (-40°C to 85°C)V = Industrial Plus (-40°C to 105°C)A = Automotive, AEC-Q100 grade 3 (-40°C to 85°C)B = Automotive, AEC-Q100 grade 2 (-40°C to 105°C)M = Automotive, AEC-Q100 grade 1 (-40°C to 125°C) XX Model Number 00 = x8 Default Boot, (6x8mm), 1.0mm height (VAA024)01 = x1 Default Boot, (6x8mm), 1.0mm height (VAA024)02 = x8 Default Boot, (8x8mm), 1.0mm height (VAC024)03 = x1 Default Boot, (8x8mm), 1.0mm height (VAC024)04 = x8 Default Boot, (8 x 8 mm), stacked 1 Gb die05 = x1 Default Boot, (8 x 8 mm), stacked 1 Gb die X Packing Type 0Tray3 = 13\'\' Tape & reel
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.
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