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Device: S29AL016MxxBxxR2 [BGA48]

Manufacturer: Spansion

Part number description for this device:

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S Spansion Memory  
XX Product Series 29 = Sector erase NOR Flash memory70 = Page-mode Flash memory
X Flash Interface And Simultaneous Read-Write J = Standard, simultaneous read-writeA = Standard, no simultaneous read-writeP = Page, simultaneous read-writeG = Page, no simultaneous read-writeW = Burst (Demux add/data), simultaneous read-writeR = Burst (Demux add/data), no simultaneous read-writeN = Burst (Mux add/data), simultaneous read-writeK = Burst (Mux add/data), no simultaneous read-writeC = Automotive burst (Demux), simultaneous read-writeV = Value family, simutaneous read-write,burst mode flash memory with multiplexed I/OX = Address-high, address-low, data multiplexed
X Core Voltage F = 5.0 V VccL = 3.0 V VccD = 2.5 V VccS = 1.8V Vcc
XXX Density 001-999 = 1Mb - 999Mb01G-64G = 1Gb - 64Gb
X Process Technology B = 320 nm, Floating gate technologyC = 320 nm, Floating gate technologyD = 200 nm, Floating gate technologyG = 170 nm, Floating gate technologyH = 130 nm, Floating gate technologyJ = 110 nm, Floating gate technologyM = 230 nm, MirrorBit technologyA = 200 nm MirrorBit technologyN = 110 nm, MirrorBit technologyP = 90 nm, MirrorBit technologyK = 90 nm Floating gate technologyR = 65 nm, MirrorBit technologyS = 65nm, MirrorBit Eclipse technologyT = 45 nm, MirrorBit Eclipse technology
XX Speed Option/Clock Rate - represents random access time (ns).If greater than 100 ns, use the two leftmost digitsClock rate suffix:AA = 104 MHz0P = 66 MHzOS = 83 MHzAB = 104 MHz
X Package Type B = FBGABH = Very Thin Fine-Pitch BGAC = CSOP (Lead Frame)E = Super CSP (BGA)D, F, G = Fortified BGAM = SOIC/SOP (Lead Frame)N = WSON (Lead Frame)Q = Plastic QFPT = TSOPS = SOP
X Package Material Set BlankA = Standard, not lead (Pb)-freeF = Standard, lead (Pb)-freeJ = (Pb)-free, LF35 packageH = Low halogen, PB-free
X Temperature Range E = Engineering samplesC = Commercial (0°C to 70°C)W = Wireless (-25°C to 85°C)I = Industrial (-40°C to 85°C)N = Extended (-40°C to 125°C)A = Automotive
XX Additional Ordering Option/Model Number e.g. R0, R1, R2 ... R9, S1..S4, or other two digits number
X Packing Type 0Tray1 = Tube2 = 7\\\'\\\' Tape & Reel3 = 13\'\' Tape & Reel

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: BGA-0245/0518 (70-0245/0518) = BGA-Bottom-1 (70-0245) + BGA-Top-79 ZIF-CS (70-0518)
BeeHive204AP adapter/module: AP1 BGA48-1.02 ZIF NOR-1 (71-3091)
BeeHive208S adapter/module: BGA-0245/0518 (70-0245/0518) = BGA-Bottom-1 (70-0245) + BGA-Top-79 ZIF-CS (70-0518)
BeeProg2 adapter/module: BGA-0245/0518 (70-0245/0518) = BGA-Bottom-1 (70-0245) + BGA-Top-79 ZIF-CS (70-0518)
BeeProg2AP adapter/module: AP1 BGA48-1.02 ZIF NOR-1 (71-3091)
BeeProg2C adapter/module: BGA-0245/0518 (70-0245/0518) = BGA-Bottom-1 (70-0245) + BGA-Top-79 ZIF-CS (70-0518)
BeeHive204AP-AU (discontinued) adapter/module: AP1 BGA48-1.02 ZIF NOR-1 (71-3091)
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