Device: THGBM1G7D8EBAI0 [BGA169]
Manufacturer: Toshiba
Part number description: |
TH X X X X XX X X X XX X X |
| Move the cursor over the box to highlight particular section |
| TH | Toshiba Hybrid IC | |
| X | Type Of Flash | |
| X | Voltage Type | B = Vcc=3.3V, VccQ=3.3V or 1.8V |
| X | NAND Interface | M = e-MMC type |
| X | Controller Revision | |
| XX | Memory Density | G6 = 64Gbit |
| X | NAND Cell Level | C = 4LC |
| X | Number Of Stacked NAND Chip/Package | |
| X | NAND Design Rule | L = 15nm |
| XX | Package Type | BA = BGA |
| X | Temperature Range | I = -25°C to 85°C |
| X | Package Size | L = 11.5x13x.0.8mm |
Supported by programmers and programming adapters/modules:
| BeeHive204 | adapter/module: BGA-Bottom-165 (70-1009) + BGA-Top-144 ZIF-CS (a) (70-2338A) OR BGA-Bottom-165 (70-1009) + BGA-Top-302 ZIF (a) (70-2829A) OR BGA-Bottom-165 (70-1009) + BGA-Top-144 ZIF-CS (discontinued) OR BGA-Bottom-165 (70-1009) + BGA-Top-302 ZIF (discontinued) |
| BeeHive208S | adapter/module: BGA-Bottom-165 (70-1009) + BGA-Top-144 ZIF-CS (a) (70-2338A) OR BGA-Bottom-165 (70-1009) + BGA-Top-302 ZIF (a) (70-2829A) OR BGA-Bottom-165 (70-1009) + BGA-Top-144 ZIF-CS (discontinued) OR BGA-Bottom-165 (70-1009) + BGA-Top-302 ZIF (discontinued) |
| BeeHive304 | adapter/module: AP3 BGA169-2.01 eMMC-1 (73-3044) |
| BeeProg2 | adapter/module: BGA-Bottom-165 (70-1009) + BGA-Top-144 ZIF-CS (a) (70-2338A) OR BGA-Bottom-165 (70-1009) + BGA-Top-302 ZIF (a) (70-2829A) OR BGA-Bottom-165 (70-1009) + BGA-Top-144 ZIF-CS (discontinued) OR BGA-Bottom-165 (70-1009) + BGA-Top-302 ZIF (discontinued) |
| BeeProg2C | adapter/module: BGA-Bottom-165 (70-1009) + BGA-Top-144 ZIF-CS (a) (70-2338A) OR BGA-Bottom-165 (70-1009) + BGA-Top-302 ZIF (a) (70-2829A) OR BGA-Bottom-165 (70-1009) + BGA-Top-144 ZIF-CS (discontinued) OR BGA-Bottom-165 (70-1009) + BGA-Top-302 ZIF (discontinued) |
| BeeProg3 | adapter/module: AP3 BGA169-2.01 eMMC-1 (73-3044) |
