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Device: THGBM3G6D2FBAIE [TFBGA169]

Manufacturer: Toshiba

Part number description for this device:

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TH Toshiba Hybrid IC  
X Type Of Flash  
X Voltage Type B = Vcc=3.3V, VccQ=3.3V or 1.8V
X NAND Interface M = e-MMC type
X Controller Revision  
XX Memory Density G6 = 64Gbit
X NAND Cell Level C = 4LC
X Number Of Stacked NAND Chip/Package  
X NAND Design Rule L = 15nm
XX Package Type BA = BGA
X Temperature Range I = -25°C to 85°C
X Package Size L = 11.5x13x.0.8mm

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: BGA-Bottom-165 (70-1009) OR BGA-Top-193 ZIF-CS (a) (70-1010A) OR BGA-Bottom-165 (70-1009) OR BGA-Top-299 ZIF (a) (70-2811A)
BeeHive204AP adapter/module: AP1 BGA169-1.01 eMMC-1 (71-3193)
BeeHive208S adapter/module: BGA-Bottom-165 (70-1009) OR BGA-Top-193 ZIF-CS (a) (70-1010A) OR BGA-Bottom-165 (70-1009) OR BGA-Top-299 ZIF (a) (70-2811A)
BeeHive304 adapter/module: AP3 BGA169-1.01 eMMC-1 (73-3043)
BeeProg2 adapter/module: BGA-Bottom-165 (70-1009) OR BGA-Top-193 ZIF-CS (a) (70-1010A) OR BGA-Bottom-165 (70-1009) OR BGA-Top-299 ZIF (a) (70-2811A)
BeeProg2AP adapter/module: AP1 BGA169-1.01 eMMC-1 (71-3193)
BeeProg2C adapter/module: BGA-Bottom-165 (70-1009) OR BGA-Top-193 ZIF-CS (a) (70-1010A) OR BGA-Bottom-165 (70-1009) OR BGA-Top-299 ZIF (a) (70-2811A)
BeeProg3 adapter/module: AP3 BGA169-1.01 eMMC-1 (73-3043)
BeeHive204AP-AU (discontinued) adapter/module: AP1 BGA169-1.01 eMMC-1 (71-3193)
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