Device: THGBMHG9C8LBAB8 [TFBGA153]
Manufacturer: Toshiba
Part number description: |
TH X X X X XX X X X XX X X |
| Move the cursor over the box to highlight particular section |
| TH | Toshiba Hybrid IC | |
| X | Type Of Flash | |
| X | Voltage Type | B = Vcc=3.3V, VccQ=3.3V or 1.8V |
| X | NAND Interface | M = e-MMC type |
| X | Controller Revision | |
| XX | Memory Density | G6 = 64Gbit |
| X | NAND Cell Level | C = 4LC |
| X | Number Of Stacked NAND Chip/Package | |
| X | NAND Design Rule | L = 15nm |
| XX | Package Type | BA = BGA |
| X | Temperature Range | I = -25°C to 85°C |
| X | Package Size | L = 11.5x13x.0.8mm |
Supported by programmers and programming adapters/modules:
| BeeHive204 | adapter/module: BGA-3110/2512A (70-3110/2512A) = BGA-Bottom-327 (70-3110) + BGA-Top-271 ZIF-CS (a) (70-2512A) OR BGA-3110/2635A (70-3110/2635A) = BGA-Bottom-327 (70-3110) + BGA-Top-284 ZIF (a) (70-2635A) |
| BeeHive204AP | adapter/module: AP1 BGA153-1.01 eMMC-1 (71-3322) |
| BeeHive208S | adapter/module: BGA-3110/2512A (70-3110/2512A) = BGA-Bottom-327 (70-3110) + BGA-Top-271 ZIF-CS (a) (70-2512A) OR BGA-3110/2635A (70-3110/2635A) = BGA-Bottom-327 (70-3110) + BGA-Top-284 ZIF (a) (70-2635A) |
| BeeHive304 | adapter/module: AP3 BGA153-1.01 eMMC-1 (73-3040) |
| BeeProg2 | adapter/module: BGA-3110/2512A (70-3110/2512A) = BGA-Bottom-327 (70-3110) + BGA-Top-271 ZIF-CS (a) (70-2512A) OR BGA-3110/2635A (70-3110/2635A) = BGA-Bottom-327 (70-3110) + BGA-Top-284 ZIF (a) (70-2635A) |
| BeeProg2AP | adapter/module: AP1 BGA153-1.01 eMMC-1 (71-3322) |
| BeeProg2C | adapter/module: BGA-3110/2512A (70-3110/2512A) = BGA-Bottom-327 (70-3110) + BGA-Top-271 ZIF-CS (a) (70-2512A) OR BGA-3110/2635A (70-3110/2635A) = BGA-Bottom-327 (70-3110) + BGA-Top-284 ZIF (a) (70-2635A) |
| BeeProg3 | adapter/module: AP3 BGA153-1.01 eMMC-1 (73-3040) |
| BeeHive204AP-AU (discontinued) | adapter/module: AP1 BGA153-1.01 eMMC-1 (71-3322) |
