Device: THGBMJG6C1LBAIL [WFBGA153] (PAN-03)
Manufacturer: Toshiba
Part number description: |
TH X X X X XX X X X XX X X |
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TH | Toshiba Hybrid IC | |
X | Type Of Flash | |
X | Voltage Type | B = Vcc=3.3V, VccQ=3.3V or 1.8V |
X | NAND Interface | M = e-MMC type |
X | Controller Revision | |
XX | Memory Density | G6 = 64Gbit |
X | NAND Cell Level | C = 4LC |
X | Number Of Stacked NAND Chip/Package | |
X | NAND Design Rule | L = 15nm |
XX | Package Type | BA = BGA |
X | Temperature Range | I = -25°C to 85°C |
X | Package Size | L = 11.5x13x.0.8mm |
Supported by programmers and programming adapters/modules:
BeeHive304 | adapter/module: AP3 BGA153-1.01 eMMC-1 (73-3040) Support of this chip is restricted to some programmer[s] only. Contact manufacturer of programmer for details. |
BeeProg3 | adapter/module: AP3 BGA153-1.01 eMMC-1 (73-3040) Support of this chip is restricted to some programmer[s] only. Contact manufacturer of programmer for details. |