TMP |
Toshiba Microcontrollers |
|
XX |
Core |
M0 = Arm Cortex-M0M3 = Arm Cortex-M3M4 = Arm Cortex-M4 with FPU |
X |
Product Group |
TXZ familyH = For general-purpose/consumer electronic equipmentK = For motor/inverter control industrial equipment (MCU+AMP/COMP)G = For OA/digital equipment/industrial equipmentE = For robotics, precision instruments controlP = For healtcare/battery equipment |
X |
Pin Count |
0,G = Under 32 pin1,H = 33 pin to 44 pin2,J = 45 pin to 48 pin3,K = 49 pin to 52 pin4,L = 53 pin to 64 pin5,M = 65 pin to 80 pin6,N = 81 pin to 100 pin7,P = 101 pin to 128 pin8,Q = 129 pin to 144 pin9,R = 145 pin to 176 pinA,S = 177 pin to 200 pinB,T = 201 pin to 224 pinC,U = 225 pin to 250 pinD,V = 251 pin o 300 pin |
X |
ROM Type |
F = FlashC = Mask |
X |
ROM Size |
M = 32kBP = 48kBS = 64kBU = 96kBW = 128kBY = 256kBZ = 384kBD = 512kBE = 768kB10 = 1023kB15 = 1536kB20 = 2048kB40 = 4096kB80 = 8192kB |
X |
Revision |
|
XX |
Package Type |
QG = Plastic shrink quat outline non-leaded package, dry-packedUG, DUG, FG, DFG = Plastic quad flat package, dry-packedMG, DMG = Plastic small-outline package, dry-packedXBG = Plastic ball grid array, dry-packed |