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Device: W19B320SB [TFBGA48]

Manufacturer: Winbond

Part number description for this device:

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W Winbond Standard Product  
XX Product Line 19 = WinStack Flash memory
X Product Category Mark B = 2.7V to 3.6VL = 3.0V to 3.6V
XX Density 16 = 2Mx8 / 1Mx1632 = 4Mx8 / 2Mx16
X Multiple Bank Architectures 0Single Bank2 = 4M + 28M3 = 8M + 24M4 = 16M + 16M
X Bank Category S = Single BankM = Multiple Banks
X Product Characteristic T = Top BootB = Bottom Boot
X Package Type T = TSOPB = TFBGA
X Access Time 9 = 90 ns
X Cycling, Operating Temperature B = 10K, 0°C - 70°CC = 100K, 0°C - 70°CF = 10K, -20°C - 85°CG = 100K, -20°C - 85°CK = 10K, -40°C - 85°CL = 100K, -40°C - 85°CAG = 100K, -20°C - 85°C

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: BGA-0245/0734 (70-0245/0734) = BGA-Bottom-1 (70-0245) + BGA-Top-135 ZIF (70-0734)
BeeHive204AP adapter/module: AP1 BGA-0245/0734 (71-2075)
BeeHive208S adapter/module: BGA-0245/0734 (70-0245/0734) = BGA-Bottom-1 (70-0245) + BGA-Top-135 ZIF (70-0734)
BeeProg2 adapter/module: BGA-0245/0734 (70-0245/0734) = BGA-Bottom-1 (70-0245) + BGA-Top-135 ZIF (70-0734)
BeeProg2AP adapter/module: AP1 BGA-0245/0734 (71-2075)
BeeProg2C adapter/module: BGA-0245/0734 (70-0245/0734) = BGA-Bottom-1 (70-0245) + BGA-Top-135 ZIF (70-0734)
BeeHive204AP-AU (discontinued) adapter/module: AP1 BGA-0245/0734 (71-2075)
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