Device: W25Q64CV [SOIC16]
Manufacturer: Winbond
Part number description for this device:
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| XXX | Family Descriptor | 25P = spiFlash serial flash memory 25Q = spiFlash Serial Flash Memory with 4KB sectors, Dual/Quad I/O 25X, 25D = spiFlash serial flash memory with 4kB sectors, dual outputs 25B = spiFlash serial flash memory with boot and parameter sectors |
| XXX | Density | 10, 10A, 10B, 10C, 10R = 1Mbit 20, 20A, 20B, 20C, 20R, 21E = 2Mbit 40, 40A, 40B, 40C, 40R = 4Mbit 80, 80A, 80B, 80D, 81D = 8Mbit 16, 16A, 16B, 16C, 16D, 16J = 16Mbit 32, 32A, 32B, 32D, 32F = 32Mbit 64, 64B, 64C, 64D, 64F = 64Mbit 128B, 128F, 12P = 128Mbit 256F, 257F = 256Mbit 512J = 512Mbit 01J = 1Gbit 02J = 2Gbit |
| X | Supply Voltage | L = 2.3V to 3.3V V = 2.7V to 3.6V W = 1.65V to 1.95V |
| XX | Package Type | DA = PDIP8 300mil SN = SOIC8 150mil SS = SOIC8 200mil S = SOIC8 200mil (W25Q128FV) SF = SOIC16 300mil F = SOIC16 300mil (W25Q128/256FV) CN = SOP8 150mil CS = SOP8 208mil SV = VSOP8 150mil ST, T = VSOP8 208mil UX = USON8 2x3mm UU = USON8 4x3mm CP, ZP = WSON8 6x5mm P = WSON8 6x5mm (W25Q128FV) ZE = WSON8 8x6mm E = WSON8 8x6mm (W25Q128/256FV) XH = XSON8 2x3mm TB = TFBGA24 8x6mm (5x5-1 ball array) B = TFBGA24 8x6mm (5x5 ball array) (W25Q128FV) TC = TFBGA24 8x6mm (6x4 ball array) C = TFBGA24 8x6mm (6x4 ball array) (W25Q128/256FV) BY = WLCSP8 |
| X | Temperature Range | C = Commercial (0°C to 70°C) I = Industrial (-40°C to 85°C) A = Automotive Grade 2 (-40°C to +105°C) J = Industrial Plus (-40°C to +105°C) S |
| X | Special Options | Blank = Standard G = Green package (Lead-free, RoHS compliant, Halogen-free (TBBA), Antimony-Oxide-free Sb203) Z = Lead free (Lead-free, RoHS compliant) 1 = One time program (OTP) enabled P = Green Package with Status Register Power-Down & OTP enabled Q = Green Package with QE=1 in Status Register-2 M = Green Package (Lead-free, RoHS Compliant, Halogen-free (TBBA), Antimony-Oxide-free SB2O3) & optimized for mobile applications N = Green Package with QE=1 in Status register-2 & DRV=75\\\\% E = Green Package with Extended Pad F = Green Package with QE=0 in Status Register-2 & SFDP |
| XXX | Transfer Rate | Blank = Single transfer rate DTR = Double transfer rate |
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.
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