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Device: W39L020 [TSOP32]

Manufacturer: Winbond

Part number description for this device:

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W Winbond Standard Product  
XX Product Line 39 = Flash Memory
X Product Category Mark F = 5V CMOS FlashL = 3.3V CMOS Flash
XX Density 010 = 128kx8020 = 256kx8040 = 512kx8101, 102 = 64kx16512 = 64kx8
X Package Type Blank = Plastic DIPS = PSOPP = PLCCT = TSOPQ = STSOP
XX Access Time 45 = 45 ns70 = 70 ns90 = 90 ns12 = 120 ns15 = 150 ns
X Cycling, Operating Temperature A = 100, 0°C - 70°CB = 10K, 0°C - 70°CC = 100K, 0°C - 70°CF = 10K, -20°C - 85°CG = 100K, -20°C - 85°CL = 100K, -40°C - 85°CK = 10K, -40°C - 85°C

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: DIL32/TSOP32 ZIF 18.4mm (70-0399) OR Bottom TSOP32 NOR-2 (70-1247) OR Top TSOP32 ZIF 18.4mm (70-1250)
BeeHive204AP adapter/module: AP1 TSOP32 ZIF 18.4mm (71-1925)
BeeHive208S adapter/module: DIL32/TSOP32 ZIF 18.4mm (70-0399) OR Bottom TSOP32 NOR-2 (70-1247) OR Top TSOP32 ZIF 18.4mm (70-1250)
BeeProg2 adapter/module: DIL32/TSOP32 ZIF 18.4mm (70-0399) OR Bottom TSOP32 NOR-2 (70-1247) OR Top TSOP32 ZIF 18.4mm (70-1250)
BeeProg2AP adapter/module: AP1 TSOP32 ZIF 18.4mm (71-1925)
BeeProg2C adapter/module: DIL32/TSOP32 ZIF 18.4mm (70-0399) OR Bottom TSOP32 NOR-2 (70-1247) OR Top TSOP32 ZIF 18.4mm (70-1250)
SmartProg2 adapter/module: DIL32/TSOP32 ZIF 18.4mm Flash (70-0136)
BeeHive204AP-AU (discontinued) adapter/module: AP1 TSOP32 ZIF 18.4mm (71-1925)
MEMprog2 (discontinued) adapter/module: DIL32/TSOP32 ZIF 18.4mm Flash (70-0136)
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