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AP1 BGA63-1 ZIF NAND-1 (LD)
(Ord. no. 71-3669LD)

See: Module manual | Accepted package(s) | Usable for programmer(s) | List of supported devices
  • 71-3669LD

    Price: US $515.00 [read this!][read this!])
    Price 4-7: US $473.80
    Price 8+ : Ask for price [?]

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  • specialized module for NAND flash devices in package BGA63 11x9mm, pitch 0.8mm
  • designed for TurboMode
  • used ZIF socket may accept one or more variants of supported package, different in ball diameter, ball high and/or body thickness, see section Accepted package(s)
  • operating (mechanical) life of ZIF socket - 10,000 actuations
  • supported from PG4UW software version 3.21g
  • made in Slovakia
Ord. no. 71-3669LD
Socket ZIF BGA63, OpenTop type
Bottom 2 female connectors by 32 pins, DIN41612 B/2
Class Specialized
Subclass Memory (NOR/NAND/eMMC)
Availability in stock 44This number indicates quantity of items that could be produced from components in stock. Reasonable quantity of this product can be available within 3 working days. pcs. within 3 days
Module manual
  • Protect the contacts of module connectors and ZIF socket from contamination. Any dirt and/or fat on contacts may cause errors during programming.
  • Proceed with care! Incorrect insertion of device in module ZIF socket may lead to programmed device damage.

  • Unscrew 2 knurled thumb screws. Insert programming module into Programming Module Interface connectors, until it clicks. Due to connectors shape, only one orientation and position of programming module in Programming Module Interface connectors is possible. Screw 2 knurled thumb screws to fix programming module to programmer.
  • Push the cover of module ZIF socket (the topmost movable part) to open the socket. Insert the device into module ZIF socket. For correct device orientation, follow the instructions shown on picture in PG4UW software Device info window for device being programmed. Then release module ZIF socket.
  • The cover must be fully actuated (depressed) before inserting a device into the socket. If device is inserted into only partially opened ZIF socket, then - after releasing of cover - the tweezer contacts might bend and if repeated several times this way tweezer contacts might even break. Do not press on device while inserting it and/or releasing the cover
  • Do not press on device while inserting it and/or releasing the cover.
  • Visually check the placement of programmed device in module ZIF socket. If everything looks OK, the device is ready for programming.
  • To take out the device from module, push the cover of module ZIF socket and remove the device.
  • When you finish the work with module, unscrew 2 knurled thumb screws and remove the module from Programming Module Interface connectors.

  • Operating conditions: temperature 5°C ÷ 40°C (41°F ÷ 104°F), humidity 20% ÷ 80% non-condensing

Software note
  • If software version, you're using currently, doesn't contain support for this programming module, please download the latest version of software - Regular or OnDemand - from our web site.
 
Accepted package(s)
BGA package Package
Design
NAMESYMBOLMINNOMMAX
ProfileA--1.2
Ball HeightA10.25--
Body ThicknessA2---
Ball Diameterb0.40.450.5
Body SizeD10.91111.1
Body SizeE8.999.1
Ball Pitche-0.8-
Ball Array DGD-12-
Ball Array EGE-10-
NAMESYMBOLMINNOMMAX
ProfileA0.80.91
Ball HeightA10.270.320.37
Body ThicknessA2---
Ball Diameterb0.40.450.5
Body SizeD8.999.1
Body SizeE6.977.1
Ball Pitche-0.8-
Ball Array DGD-10-
Ball Array EGE-8-
NAMESYMBOLMINNOMMAX
ProfileA0.80.91
Ball HeightA10.270.320.37
Body ThicknessA2---
Ball Diameterb0.40.450.5
Body SizeD10.91111.1
Body SizeE8.999.1
Ball Pitche-0.8-
Ball Array DGD-12-
Ball Array EGE-10-
NAMESYMBOLMINNOMMAX
ProfileA0.80.91
Ball HeightA10.250.30.35
Body ThicknessA20.550.60.65
Ball Diameterb0.40.450.5
Body SizeD10.91111.1
Body SizeE8.999.1
Ball Pitche-0.8-
Ball Array DGD-12-
Ball Array EGE-10-
NAMESYMBOLMINNOMMAX
ProfileA--1
Ball HeightA10.25--
Body ThicknessA2---
Ball Diameterb0.40.450.5
Body SizeD10.91111.1
Body SizeE8.999.1
Ball Pitche-0.8-
Ball Array DGD-12-
Ball Array EGE-10-
NAMESYMBOLMINNOMMAX
ProfileA--1.05
Ball HeightA10.25--
Body ThicknessA2--0.7
Ball Diameterb0.40.450.5
Body SizeD10.91111.1
Body SizeE8.999.1
Ball Pitche-0.8-
Ball Array DGD-12-
Ball Array EGE-10-
NAMESYMBOLMINNOMMAX
ProfileA--1.05
Ball HeightA10.25--
Body ThicknessA2-0.65-
Ball Diameterb0.40.450.5
Body SizeD10.91111.1
Body SizeE8.999.1
Ball Pitche-0.8-
Ball Array DGD-12-
Ball Array EGE-10-
NAMESYMBOLMINNOMMAX
ProfileA--1
Ball HeightA10.25-0.35
Body ThicknessA2-0.6-
Ball Diameterb0.4-0.5
Body SizeD10.91111.1
Body SizeE8.999.1
Ball Pitche-0.8-
Ball Array DGD-12-
Ball Array EGE-10-
NAMESYMBOLMINNOMMAX
ProfileA--1
Ball HeightA10.25--
Body ThicknessA20.60.650.7
Ball Diameterb-0.45-
Body SizeD10.91111.1
Body SizeE8.999.1
Ball Pitche-0.8-
Ball Array DGD-12-
Ball Array EGE-10-
NAMESYMBOLMINNOMMAX
ProfileA--1
Ball HeightA10.25--
Body ThicknessA2---
Ball Diameterb-0.45-
Body SizeD10.91111.1
Body SizeE8.999.1
Ball Pitche-0.8-
Ball Array DGD-12-
Ball Array EGE-10-
NAMESYMBOLMINNOMMAX
ProfileA--1
Ball HeightA10.220.260.3
Body ThicknessA2---
Ball Diameterb0.410.460.51
Body SizeD-11-
Body SizeE-9-
Ball Pitche-0.8-
Ball Array DGD-12-
Ball Array EGE-10-
NAMESYMBOLMINNOMMAX
ProfileA0.80.91
Ball HeightA10.250.30.35
Body ThicknessA20.59-0.74
Ball Diameterb0.40.450.5
Body SizeD-11-
Body SizeE-9-
Ball Pitche-0.8-
Ball Array DGD-12-
Ball Array EGE-10-
NAMESYMBOLMINNOMMAX
ProfileA--1
Ball HeightA10.25--
Body ThicknessA2---
Ball Diameterb0.40.450.5
Body SizeD-11-
Body SizeE-9-
Ball Pitche-0.8-
Ball Array DGD-12-
Ball Array EGE-10-




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