Obvod: 3DFN16G08VS2306-PORTOS [SOP50]
Výrobca: 3D Plus
Popis označenia obvodu pre toto zariadenie:
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3D
XX
XXXX
XX
X
X
X
XXX
X
X
X
X
XX
X
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| Nabehnutím kurzora zvýraznite konkrétnu sekciu. |
3D |
3D Plus Module |
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XX |
Module Type |
DP = DPRAMEE = EEPROMFN = Flash NANDFO = Flash NORFR = FRAMMR = MRAMPO = PROMSF = StrataFlashSD = Synchronous RAMSR = Static RAM1D = DDR12D = DDR2 |
XXXX |
Module Density |
nnnK = nnn kilobitnnnM = nnn MegabitnnnG = nnn GigabitnnnT = nnn Terabit |
XX |
Module Data Bit |
04 = x4 bit08 = x8 bit16 = x16 bit32 = x32 bit40 = x40 bit48 = x48 bit64 = x64 bitnn = xnn bit |
X |
Module Voltage |
C = 5.0 VV = 3.3VS = 2.8VT = 2.5VU = 1.8V |
X |
Module Package |
B = BGAC = ConnectorJ = QFJP = PGAQ = QFPS = SOPW = Wire Bond |
X |
Stacked Layers |
1 = 1 layer2 = 2 layers4 = 4 layers8 = 8 layersn = n layersA = 10 layers |
XXX |
Control Features / Flayer Reference |
nnn = Product flayer number |
X |
Temperature Range |
C = 0°C to 70°CI = -40°C to 85°CM = -55°C to 125°CS = Specific |
X |
Quality Level |
N = Commercial gradeB = Industrial gradeS = Space gradeC = Custom |
X |
Space Screening Option |
Blank = ESA qualified (quality grade for space applications ECSS-Q-60-05C)P = NASA PEM selection (screening and qualification PEM-INST-001) |
X |
Radiation Assurance |
R = Radiation data testedA = Generic radiation data available- = Not applicable |
XX |
Speed / Access Time |
00 = N/ASRAM10 = 10 ns12 = 12 ns15 = 15 ns20 = 20 nsMRAM35 = 35 nsFRAM60 = 60 nsSDRAM50 = 5 ns55 = 5.5 ns60 = 6 ns70 = 7 ns75 = 7.5 ns80 = 8 nsDDR- first digit:5 = 500 MHz6 = 166 MHz7 = 133 MHz8 = 100 MHz- second digit:C = CL = 3B = CL = 2.5A = CL = 2DDR2- first digit4 = DDR2-400 (200 MHz)5 = DDR2-533 (266 MHz)6 = DDR2-667 (333 MHz)8 = DDR2-800 (400 MHz)- second digit:A = CL = 3, tRCD = 3, tRP = 3C = CL = 4, tRCD = 4, tRP = 4E = CL = 5, tRCD = 5, tRP = 5G = CL = 6, tRCD = 6, tRP = 6FLASH03 = 30 ns05 = 50 ns07 = 70 ns08 = 80 ns09 = 90 ns10 = 100 ns11 = 110 ns12 = 120 ns25 = 25 ns35 = 35 ns |
X |
Module Option |
Blank = No optionA = ARATHANE finishE = EPOTEK 302-3MH = Hermetic packageM = MAPSIL finishT = Tantalum shieldingW = WALOPACK shieldengX = XV501T4 finish solder |
Poznámka Tabuľka s popisom čísel dielov popisuje bežný systém číslovania dielov pre viac čipov, preto táto tabuľka môže obsahovať informácie, ktoré nemusia byť platné pre aktuálne vybraný čip. Tu uvedené informácie sú poskytované na základe maximálneho úsilia a môžu byť nepresné alebo neúplné. Preto vždy skontrolujte najnovší technický list čipu, kde nájdete detailný popis čísla dielu. Ak nájdete nejakú nepresnosť, dajte nám vedieť.
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