| Am | AMD Products | |
| XXXX | Family Signature | 29DL = 3V, Simuiltaneous Read/Write |
| XXX | Density, Bus Width and Sector Organization | 16x = 2Mx8 / 1Mx1632x = 4Mx8 / 2Mx16400 = 512kx8 / 256kx16640 = 8Mx8 / 4Mx16800 = 1Mx8 / 512kx16 |
| X | Process Technology | B = 0.32 um technologyC = 0.32 um thin-film technologyD = 0.23 um thin-film technologyG = 0.17 um thin-film technologyH = 0.13 um thin-film technologyM = MirrorBit technology |
| XX | Sector Architecture and Sector Write Protection | U, Blank = Uniform sector deviceB = Bottom boot sectorT = Top boot sectorH = Uniform sector device, highest address sector protectedL = Uniform sector device, lowest address sector protectedJ40 = (Ultra NAND only) 100\% usable blocks |
| XXX | Speed Option, Voltage regulation | **(*) = 2 or 3 digits indicates speed in ns, device is full voltage range, Vcc=2.7V to 3.6V**(*)R = 2 or 3 digits indicate speed in ns, „R“ indicates regulated voltage range Vcc=3V to 3.6V |
| X | Package Type | P = Plastic DILJ = Plastic LCCS = SOPZ = SSOPE = TSOPE2 = TSOP IIF = Reverse TSOPF2 = Reverse TSOP II0.8mm ball pitch (unless otherwise noted) :MA = 63-ball FBGA (11x12mm)VA = 44-ball FBGA (9.2x8mm, 0.5mm pitch)VR = 48-ball, VFBGA (8.15x6.15mm)WA = 48-ball FBGA (6x8mm)WB = 48-ball, FBGA (6x9mm)WC = 48-ball, FBGA (8x9mm)WD = 63-ball, FBGA (8x14mm)WG = 40-ball, FBGA (8x15mm)WH = 63-ball, FBGA (12x11mm)WK = 47-ball, FBGA (7x10mm, 0.5mm pitch)WL = 48-ball, (11x10mm, 0.5mm pitch)WM = 48-ball, (6x12mm)WN = 84-ball, FBGA(11x12mm)1.0mm ball pitch (unless othervise noted) :PA = 64-ball, BGA (13x11mm, 1.7mm)PB = 80-ball, BGA (13x11mm)PC = 64-ball, BGA (13x11mm)PE = 80-ball, BGA(10x15mm) |
| X | Temperature Range | C = CommercialI = IndustrialE = Extended |
| X | Optional Proccessing | Blank = Standard ProccessingN = ESN devicesB = Burn-in |
