| Am |
AMD Products |
|
| XXXX |
Family Signature |
29BDS = 1.8V, simultaneous Read/Write, Burst Mode29DS = 1.8V, simultaneous Read/Write29PDS = 1.8V, simultaneous Read/Write, Pge mode29SL = 1.8V Flash29BDD = 2.5V, simultaneous Read/Write, Burst mode29LV = 3V Flash29DL = 3V, Simuiltaneous Read/Write29BL = 3V, Burst mode29PL = 3V, Page mode29PDL = 3V, Simultaneous Read/Write, Page mode30LV = 3V, Ultra NAND29F = 5V Flash |
| XXX |
Density, Bus Width and Sector Organization |
001, 010 = 128kx8002 = 256kx8004, 040 = 512kx8008, 080, 081 = 1Mx8016, 017, 116 = 2Mx8032, 033 = 4Mx8065 = 8Mx8100 = 64kx16160 = 2Mx8 / 1Mx16200 = 128kx16320 = 4Mx8 / 2Mx16400 = 256kx16640, 641 = 4Mx16800 = 1Mx8 / 512kx16 |
| (X) |
Optional Parameter |
N = No RESET inputA = 5V-Only Program and Erase |
| X |
Process Technology |
B = 0.32 um technologyC = 0.32 um thin-film technologyD = 0.23 um thin-film technologyG = 0.17 um thin-film technologyM = MirrorBit technology |
| XX |
Sector Architecture and Sector Write Protection |
T = Top boot sectorB = Bottom boot sectorH = Uniform sector device, highest address sector protectedL = Uniform sector device, lowest address sector protectedU, Blank = Uniform sector deviceJ40 = (Ultra NAND only) 100% usable blocks |
| XXX |
Speed Option, Voltage Regulation |
1.8V devices:xx(x) = (29SL,DS) indicates speed in ns, Vcc=1.8V to 2.2VxA, xB = (29BDS) digits indicates asynchronous speed (5=55ns, 7=70ns, 9=90ns, 11=110ns),letter represents burst mode speed and handshaking availability(A=40MHz, B=54MHz), Vcc=1.7V to 1.9V3V devices:xx(x) = indicates speed in ns or MHz, device is full voltage range, Vcc=2.7V to 3.6Vxx(x)R = 2 or 3 digits indicate speed in ns, „R“ indicates regulated voltage range Vcc=3.0V to 3.6Vx(x)1(R) = (29LV64X) first two digits indicate speed in nsx10. „1“ indicates Vio < Vcc, „R“, if present indicatregulated voltage range5V devices:x(x)0 = speed option ends in „0“: indicates speed in ns., Vcc=5V +/- 10%x5 = speed option ends in „5“: indicates speed in ns |
| X |
Package Type |
P = Plastic DILJ = Plastic LCCS = SOPZ = SSOPE = TSOPE2 = TSOP IIF = reverse TSOPF2 = reverse TSOP IIK = 80-pin PQFP0.8mm ball pitch (unless otherwise noted):MA = 63-ball FBGA (11x12mm)VA = 44-ball FBGA (9.2x8mm, 0.5mm pitch)VR = 48-ball, VFBGA (8.15x6.15mm)WA = 48-ball FBGA (6x8mm)WB = 48-ball, FBGA (6x9mm)WC = 48-ball, FBGA (8x9mm)WD = 63-ball, FBGA (8x14mm)WG = 40-ball, FBGA (8x15mm)WH = 63-ball, FBGA (12x11mm)WK = 47-ball, FBGA (7x10mm, 0.5mm pitch)WL = 48-ball, (11x10mm, 0.5mm pitch)WM = 48-ball, (6x12mm)WN = 84-ball, FBGA(11x12mm)WP = 84-ball, FBGA(FBF084)1.0mm ball pitch (unless othervise noted):PA = 64-ball, BGA (13x11mm, 1.7mm)PB = 80-ball, BGA (13x11mm)PC = 64-ball, BGA (13x11mm)PE = 80-ball, BGA (10x15mm) |
| X |
Temperature Range |
C = Commercial (0°C to 70°C)D = Commercial (0°C to 70°C) with Pb-free packageI = Industrial (-40°C to 85°C)F = Industrial (-40°C to 85°C) with Pb-free packageV = Automotive in-cabin (-40°C to 105°C)Y = Automotive in-cabin (-40°C to 105°C) with Pb-free packageE = Extended |
| X |
Optional Proccessing |
Blank = Standard ProccessingN = ESN devicesB = Burn-in |
