| XX |
Family Signature |
10M = MAX 10 |
| XX |
Member Code |
02 = 2K logic elements04 = 4K logic elements08 = 8K logic elements16 = 16K logic elements25 = 25K logic elements40 = 40K logic elements50 = 50K logic elements |
| XX |
Feature Options |
SC = Single supply, compact featuresSF = Single supply, flash featuresSA = Single supply, analog featuresDC = Dual supply, compact featuresDF = Dual supply, flash featuresDA = Dual supply, analog features |
| X |
Package Type |
V = Wafer-level chip scale (WLCSP)E = Plastic enhanced quad flat pack (EQFP)M = Micro FineLine BGA (MBGA)U = Ultra FineLine BGA (UBGA)F = FineLine BGA (FBGA) |
| XXX |
Package Code |
WLCSP package type:36 = 36-ball, 3mm x 3mm81 = 81-ball, 4mm x 4mmEQFP package type:144 = 144-pin, 22mm x 22mmMBGA package type:153 = 153-ball, 8mm x 8mmUBGA package type:169 = 169-ball, 11mm x 11mm324 = 324-ball, 15mm x 15mmFBGA package type:256 = 256-ball, 17mm x 17mm484 = 484-ball, 23mm x 23mm672 = 672-ball, 27mm x 27mm |
| X |
Operating Temperature |
C = Commercial (0°C to 85°C)I = Industrial (-40°C to 100°C)A = Automotive (-40°C to 125°C) |
| X |
FPGA Fabric Speed Grade |
6 = fastest78 |
| X |
Optional Suffix |
- indicates specific device options or shipment methodG = RoHS6ES = Engineering sample |
