Obvod: MT29F2G16ABDHC [VFBGA63]
Výrobca: Micron
Popis čísla dielu pre toto zariadenie:
Nabehnutím kurzora zvýraznite konkrétnu sekciu| MT | Micron Technology | |
| XXX | Product Family | 29F = Single-supply NAND flash memory29H = High speed NAND flash |
| XX | Density | 1G = 1Gbit2G = 2Gbit4G = 4Gbit8G = 8Gbit16G = 16Gbit32G = 32Gbit64G = 64Gbit128G = 128Gbit256G = 256Gbit |
| XX | Device Width | 08 = 8 bits16 = 16 bits |
| X | Classification | A = SLC, 1 die, 1 nCE, 1 RnB, 1 I/O channelB = SLC, 2 dies, 1 nCE, 1 RnB, 1 I/O channelC = SLC, 2 dies, 2 nCE, 1 RnB, 1 I/O channelD = SLC, 2 dies, 2 nCE, 2 RnB, 1 I/O channelE = SLC, 2 dies, 2 nCE, 2 RnB, 2 I/O channelsF = SLC, 4 dies, 2 nCE, 2 RnB, 1 I/O channelG = SLC, 4 dies, 2 nCE, 2 RnB, 2 I/O channelsJ = SLC, 4+4 dies, 2+2 nCE, 2+2 RnB, 1 I/O channelK = SLC, 8 dies, 4 nCE, 4 RnB, 2 I/O channelsZ = SLC, 1 die, n.a. nCE, n.a. RnB, 1 I/O channelM = MLC, 1 die, 1 nCE, 1 RnB, 1 I/O channelN = MLC, 2 dies, 1 nCE, 1 RnB, 1 I/O channelP = MLC, 2 dies, 2 nCE, 1 RnB, 1 I/O channelQ = MLC, 2 dies, 2 nCE, 2 RnB, 1 I/O channelR = MLC, 2 dies, 2 nCE, 2 RnB, 2 I/O channelsT = MLC, 4 dies, 2 nCE, 2 RnB, 1 I/O channelU = MLC, 4 dies, 2 nCE, 2 RnB, 2 I/O channelsV = MLC, 4+4 dies, 2+2 nCE, 2+2 RnB, 1 I/O channelW = MLC, 8 dies, 4 nCE, 4 RnB, 2 I/O channelsY = MLC, 8 dies, 4 nCE, 4 RnB, 1 I/O channel |
| X | Operating Voltage Range | A = 3.3V (2.70V to 3.60V), VccQ 3.3V (2.70V to 3.60V)B = 1.8V (1.70V to 1.95V)C = 3.3V (2.70V to 3.60V), VccQ 1.8V (1.70V to 1.95V) |
| X | Generation | A = 1st generationB = 2nd generationC = 3rd generationD = 4th generationetc. |
| XX | Package Type | WC = 48-pin TSOP I (OCPL version) (Pb-free)WP = 48-pin TSOP I (CPL version) (Pb-free)HC = 63-ball VFBGA, 10.5x13x1.0H1 = 100-ball VFBGA (Pb-free), 12x18x1.0H2 = 100-ball TFBGA (Pb-free), 12x18x1.2C2 = 52-pad ULGA, 12x17x0.4C3 = 52-pad ULGA, 12x17x0.65C4 = 52-pad VLGA, 12x17x1.0C5 = 52-pad VLGA, 14x18x1.0C6 = 52-pad LLGA, 14x18x1.47C7 = 48-pad LLGA, 12x20x1,47SWC = 48-pin Stacked TSOP (OCPL version) (Pb-free)SWP = 48-pin Stacked TSOP (CPL version) (Pb-free) |
| XX | Speed Grade (MT29H only) | 15 = 133 MT/s12 = 166 MT/s |
| XX | Flash Performance | Blank = Full spec |
| XX | Block Option | Blank = Standard device |
| XX | Temperature Range | Blank = Commercial (0°C to 70°C)ET = Extended (-40°C to 85°C)WT = Wireless (-25°C to 85°C) |
| XX | Production Status | Blank = ProductionES = Engineering samplesMS = Mechanical samplesQS = Qualification samples |
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| X | Device Revision | A = 1st design revisionB = 2nd design revisionetc. |
Poznámka: Tabuľka popisu čísla dielu popisuje bežný systém číslovania dielov pre viac čipov, preto môže táto tabuľka obsahovať informácie, ktoré nemusia byť platné pre aktuálne vybraný čip. Tu uvedené informácie sú poskytované na základe maximálneho úsilia a môžu byť nepresné alebo neúplné. Preto vždy skontrolujte najnovší technický list čipu, kde nájdete detailný popis čísla dielu. Ak nájdete nejakú nepresnosť, dajte nám vedieť.
vrátiť späť na zoznam výsledkovPodporovaný programátormi a programovacími adaptérmi/modulmi:
| BeeHive204 | adaptér/modul: BGA-1008/1023 (70-1008/1023) = ALEBO BGA-Bottom-148 (70-1008) ALEBO BGA-Top-196 ZIF-CS (70-1023) ALEBO BGA-2362/2361 (70-2362/2361) ALEBO BGA-Bottom-257 (70-2362) ALEBO BGA-Top-265 ZIF (70-2361) |
| BeeHive208S | adaptér/modul: BGA-1008/1023 (70-1008/1023) = ALEBO BGA-Bottom-148 (70-1008) ALEBO BGA-Top-196 ZIF-CS (70-1023) ALEBO BGA-2362/2361 (70-2362/2361) ALEBO BGA-Bottom-257 (70-2362) ALEBO BGA-Top-265 ZIF (70-2361) |
| BeeHive304 | adaptér/modul: AP3 BGA63-2.12 NAND-1 (73-3167) |
| BeeProg2 | adaptér/modul: BGA-1008/1023 (70-1008/1023) = ALEBO BGA-Bottom-148 (70-1008) ALEBO BGA-Top-196 ZIF-CS (70-1023) ALEBO BGA-2362/2361 (70-2362/2361) ALEBO BGA-Bottom-257 (70-2362) ALEBO BGA-Top-265 ZIF (70-2361) |
| BeeProg2C | adaptér/modul: BGA-1008/1023 (70-1008/1023) = ALEBO BGA-Bottom-148 (70-1008) ALEBO BGA-Top-196 ZIF-CS (70-1023) ALEBO BGA-2362/2361 (70-2362/2361) ALEBO BGA-Bottom-257 (70-2362) ALEBO BGA-Top-265 ZIF (70-2361) |
| BeeProg3 | adaptér/modul: AP3 BGA63-2.12 NAND-1 (73-3167) |
