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Obvod: K5L2731CAA-D [FBGA64]

Výrobca: Samsung

Popis čísla dielu pre toto zariadenie:

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K5 Samsung MCP Memory  
X Device Type A = NOR DB Flash + fCMOS SRAMB = NOR BB Flash + fCMOS SRAMC = Mitsubishi NOR + fCMOS SRAMD = NAND Flash + SDRAME = NAND Flash + DDR SDRAMF = NOR DB Flash + NAND FlashG = Muxed NOR Flash + SDRAMH = NOR DB Flash + SDRAMJ = NOR DB Flash + SDRAMK = De-Muxed NOR Flash + SDRAML = De-Muxed NOR Flash + UtRAMM = NOR BB Flash + TFT SRAMN = Muxed NOR Flash + Muxed UtRAMP = NAND Flash + Muxed UtRAMQ = NAND Flash + UtRAMR = OneNAND + SDRAMS = UtRAM + fCMOS SRAMT = Mitsubishi NOR Flash + UtRAMU = Muxed NOR Flash + OneNANDV = NOR DB Flash + OneNANDW = OneNAND + DDR SDRAMX = Muxed NOR + SDRAMZ = NOR DB Flash + DDR SDRAM
XX First Chip Density - when 1st chip is NOR DB Flash (x8/x16)32 = 32Mbit (8Mbit + 24Mbit)33 = 32Mbit (16Mbit + 16Mbit)63 = 64Mbit (16Mbit + 48Mbit)- when 1st chip is NOR BB Flash (x16)16 = 16Mbit32 = 32Mbit64 = 64Mbit- when 1st chip is NAND Flash (x8)12 = 512Mbit28 = 128Mbit56 = 256Mbit57 = 256Mbit (x16)- when 1st chip is UtRAM64 = 64Mbit1G = 1Gbit32 = 32Mbit- when 1st chip is Mitsubishi NOR Flash64 = 64Mbit (4Mbit+4Mbit+28Mbit+28Mbit)- when 1st chip is Muxed NOR Flash28 = 128Mbit (8Mx16, 16Bank)56 = 256Mbit (16Mx16, 16Bank)64 = 64Mbit (4Mx16, 16Bank)- when 1st chip is De-Muxed NOR Flash28 = 128Mbit (8Mbit, 16Bank)56 = 256Mbit (x16)64 = 64Mbit (16Mbit+48Mbit)66 = 64Mbit (4Mx16, 8Bank)- when 1st chip is OneNAND12 = 512Mbit (x16)56 = 256Mbit (x16)1G = 1Gbit (x16)
XX Second Chip Density - when 2nd chip is fCMOS SRAM17 = 16Mbit (x16)40 = 4Mbit (x8 / x16)41 = 4Mbit (x16)80 = 8Mbit (x8 / x16)81 = 8Mbit (x16)- when 2nd chip is TFT SRAM21 = 2Mbit (x8)- when 2nd chip is NAND Flash64 = 64Mbit (x8)- when 2nd chip is UtRAM16 = 16Mbit (x16)28 = 128Mbit (x16, Burst)32 = 32Mbit (x16)31 = 32Mbit (x16, Page)64 = 64Mbit (x16, Burst)66 = 64Mbit (x16)- when 2nd chip SDRAM12 = 512Mbit (x16)13 = 512Mbit (x32)28 = 128Mbit (x32)29 = 128Mbit (x16)57 = 256Mbit (x16)58 = 256Mbit (x32)- when 2nd chip is DDR SDRAM12 = 512Mbit (x16)13 = 512Mbit (x32)28 = 128Mbit (x32)29 = 128Mbit (x16)57 = 256Mbit (x16)58 = 256Mbit (x32)- when 2nd chip is Muxed SRAM17 = 16Mbit (x16)41 = 4Mbit (x16)81 = 8Mbit (x16)- when 2nd chip is Muxed UtRAM16 = 16Mbit (x16)- when 2nd chip is OneNAND28 = 128Mbit (x16)56 = 256Mbit (x16)
X Operating Voltage Range 8 = 1.7V to 1.9VA = 1.8V / 1.8VB = 2.6V / 2.6VC = 3.0V / 3.0VD = 2.6V / 1.8VE = 3.3V / 2.5VF = 2.8VH = 3.0V / 2.5VK = 1.9V / 1.9VL = 3.3V / 1.8VV = 3.3V / 3.3VY = 2.7V to 3.3V- only 1st chip is NAND Flash6 = 2.4V to 2.8V- when 1st chip and 2nd chip is differentG = 1.8V / 1.8V, 3.0V / 1.8VJ = 1.8V / 1.8V, 2.6V / 1.8V
X Flash Boot Block Mode A = Top & bottom boot blockB = Bottom boot blockC = Uniform blockT = Top boot block0None
X Generation M = 1st generationA = 2nd generationB = 3rd generationC = 4th generationD = 5th generationE = 6th generationF = 7th generationG = 8th generation
X Package Type A = FBGA (HF, LF)D = FBGA (LF)E = LGA (No BAll)F = FBGAH = LGA (LF)K = TBGA (Intell Ball Out)P = FBGA (OSP)S = FBGA (OSP LF)T = TBGAL = TBGA (LF)
X 1st Chip Speed - when 1st chip is NOR DB/BB & Mitsubishi NOR & UtRAM2 = 65ns3 = 85ns7 = 70ns (except UtRAM)8 = 80ns9 = 90ns- when 1st chip is burstA = 100ns (C/F 40MHz)B = 100ns (C/F 54MHz)C = 90ns (C/F 40MHz)G = 90ns (C/F 54MHz)E = 88.5ns (C/F 54MHz)F = 70ns (C/F 66MHz)H = 14.5ns (C/F 54MHz)- when 1st chip is OneNANDJ = 18.5ns (C/F 54MHz)K = 15ns (C/F 66MHz)- MCP common0NoneN = No Bin (TPB)
XX 2nd Chip Speed - when 2nd chip is fCOM SRAM & UtRAM(Muxed)10 = 100ns18 = 18.5ns50 = 50ns55 = 55ns60 = 60ns70 = 70ns85 = 85ns90 = 90nsDS = Daisychain- when 2nd chip is Muxed SRAM10 = 100ns70 = 70ns85 = 85ns90 = 90nsDS = Daisychain- when 2nd chip is SDRAM/DDR SDRAM15 = 15ns@CL260 = 6ns@CL375 = 7.5ns@CL385 = 8.5ns@CL390 = 9ns@CL395 = 9.5ns@CL31H = 10ns@CL21L = 10ns@CL39H = 9ns@CL2DS = Daisychain- when 2nd chip is Burst UtRAM54 = 54MHz66 = 66MHz- when 2nd chip is OneNAND76 = 76nsDS = Daisychain- MCP common00 = None
X Packing Type T = Tape&ReelNumber = Other(Tray, Tube, Jar)S = Stack
XX Customer "Customer List Reference"  

Poznámka: Tabuľka popisu čísla dielu popisuje bežný systém číslovania dielov pre viac čipov, preto môže táto tabuľka obsahovať informácie, ktoré nemusia byť platné pre aktuálne vybraný čip. Tu uvedené informácie sú poskytované na základe maximálneho úsilia a môžu byť nepresné alebo neúplné. Preto vždy skontrolujte najnovší technický list čipu, kde nájdete detailný popis čísla dielu. Ak nájdete nejakú nepresnosť, dajte nám vedieť.

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