Obvod: S3P9414 [SOP24]
Výrobca: Samsung
Popis čísla dielu pre toto zariadenie:
Nabehnutím kurzora zvýraznite konkrétnu sekciu| S | System LSI | |
| 3 | Microcontroller | |
| X | Family Type | C = Mask ROMF = FLASH3 = MCPE = EVA-CHIPP = OTP |
| X | Core | 1 = 51 4-bit2 = 32-bit ARM93 = 17 16-bit4 = 32 32-bit5 = 32-bit ARM106 = 56 4-bit7 = 57 4-bit8 = 88 8-bit9 = 86 8-bitA = 15 OtherB = 8-bit CALM RISC MACC = 16-bit CALM RISC MACD = 32-bit CALM RISC MACI = Custom MCUJ = SC-200K = 8-bit CALM RISCL = 16-bit CALM RISCR = 128-bit CALM RISCS = SC-100 |
| XX | Application Category | 0n = General Purpose1n = Voice2n = LCD3n = Audio4n = General A/D5n = Telecom6n = PC & Peripherial, OA7n = VFD8n = Video9n = Special (IC Card)An = General Purpose-1Cn = CFn = Telecom-1Nn = Intel ApplicationZn = Assigment Code "n" Serial No. (1~Z) |
| X | ROM Master | 0ROMless1 = 1kx82 = 2kx83 = 12kx84 = 4kx85 = 16kx86 = 6kx87 = 24kx88 = 8kx89 = 32kx8A = 48kx8B = 64kx8C = 96kx8D = 128kx8F = 256kx8G = 384kx8H = 512kx8J = 768kx8K = 1Mx8W = 144kx8 |
| X | Version | |
| XX | Mask Option | |
| XX | Package Type | A = SDIPB = LGAC = Chip BIZD = DIPE = LQFPF = WQFPG = BGAH = CSPJ = BQFPK = UELPL = ELPM = QFPHN = COBP = PLCCR = TSSOPQ = QFPS = SOPT = TQFPV = SSOPW = WafferY = FBGAZ = SBGA |
| X | Package Pin | SDIP package:B=56, M=24, O=32, Q=42, T=64, V=30LGA package:A=88, C=83, J=176DIP package:C=8, H=16, I=18, K=20, N=28, P=40LQFP package:C=144, D=160, E=208, G=256, J=176, R=48, T=64, W=80, X=100WQFP package:T=64BGA package:A=272, B=416, C=496, D=153CSP package:J=176BQFP package:B=132UELP package:T=64ELP package:R=48, T=64QFPH package:D=160, F=240COB package:C=8, D=8CNCLPLCC package:C=52, Z=44TSSOP package:R=48QFP package:A=128, C=144, D=160, E=208, G=256, R=48, T=64, U=304, W=80, X=100, Z=44SOP package:C=8, H=16, I=18, K=20, M=24, N=28, O=32TQFP package:A=128, T=64, W=80, X=100TEBGA package:X=492FBGA package:A=337, B=81, C=144, D=160, E=208, F=180, G=285, H=320, K=105,L=400, O=272, P=504, Q=289, T=64, U=83, X=100SBGA package:A=432SSOP package:H=16, K=20 |
| X | Packing | B = TubeU = BulkR = TrayT = Tape & ReelS = Tape & Reel reverseC = Chip BizD = Chip Biz (3 inch tray)E = Chip Biz (4 inch tray)F = Chip Biz (reverse)W = WF Biz Draft WaferX = WF Biz Full Cutting7 = Tape & Reel (Pb-Free PKG)8 = Tray (Pb-Free PKG)9 = Tube (Pb-Free PKG) |
| X | ROM Size | 0ROMless1 = 1kx82 = 2kx83 = 12kx84 = 4kx85 = 16kx86 = 6kx87 = 24kx88 = 8kx89 = 32kx8A = 48kx8B = 64kx8C = 96kx8D = 128kx8E = ExtendedF = 256kx8G = 384kx8H = 512kx8J = 768kx8K = 1Mx8M = MilitaryN = IndustrialW = 144kx8X = Special MK3Y = Special MK2Z = Special MK1 |
Poznámka: Tabuľka popisu čísla dielu popisuje bežný systém číslovania dielov pre viac čipov, preto môže táto tabuľka obsahovať informácie, ktoré nemusia byť platné pre aktuálne vybraný čip. Tu uvedené informácie sú poskytované na základe maximálneho úsilia a môžu byť nepresné alebo neúplné. Preto vždy skontrolujte najnovší technický list čipu, kde nájdete detailný popis čísla dielu. Ak nájdete nejakú nepresnosť, dajte nám vedieť.
vrátiť späť na zoznam výsledkovPodporovaný programátormi a programovacími adaptérmi/modulmi:
| BeeHive204 | adaptér/modul: DIL24W/SOIC24 ZIF 300mil (70-0878) |
| BeeHive204AP | adaptér/modul: AP1 SOIC24 ZIF 300mil (71-1844) |
| BeeHive208S | adaptér/modul: DIL24W/SOIC24 ZIF 300mil (70-0878) |
| BeeProg2 | adaptér/modul: DIL24W/SOIC24 ZIF 300mil (70-0878) |
| BeeProg2AP | adaptér/modul: AP1 SOIC24 ZIF 300mil (71-1844) |
| BeeProg2C | adaptér/modul: DIL24W/SOIC24 ZIF 300mil (70-0878) |
| SmartProg2 | adaptér/modul: DIL24W/SOIC24 ZIF 300mil (70-0878) |
| BeeHive204AP-AU (prestala byť podporovaná) | adaptér/modul: AP1 SOIC24 ZIF 300mil (71-1844) |
