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Obvod: S71PL254JC0BxxT [FBGA84]

Výrobca: Spansion

Popis čísla dielu pre toto zariadenie:

Nabehnutím kurzora zvýraznite konkrétnu sekciu
S Spansion Memory  
XX Product Series 71 = Multi-chip product (MCP)73 = Stacked products (MCP)98 = Stacked Multi-chip product
X Flash Interface And Simultaneous Read-Write J = Standard, simultaneous read-writeA = Standard, no simultaneous read-writeP = Page, simultaneous read-writeG = Page, no simultaneous read-writeW = Burst (Demux add/data), simultaneous read-writeR = Burst (Demux add/data), no simultaneous read-writeN = Burst (Mux add/data), simultaneous read-writeK = Burst (Mux add/data), no simultaneous read-writeC = Automotive burst (Demux), simultaneous read-writeV = Simultaneous Read/Write, Burst mode with multiplexed I/O
X Core Voltage F = 5.0 V VccL = 3.0 V VccD = 2.5 V VccS = 1.8V Vcc
XXX Density 001-999 = 1Mb - 999Mb01G-64G = 1Gb - 64Gb
X Process Technology B = 320 nm, Floating gate technologyC = 320 nm, Floating gate technologyD = 200 nm, Floating gate technologyG = 170 nm, Floating gate technologyH = 130 nm, Floating gate technologyJ = 110 nm, Floating gate technologyM = 230 nm, MirrorBit technologyA = 200 nm MirrorBit technologyN = 110 nm, MirrorBit technologyP = 90 nm, MirrorBit technologyK = 90 nm, Floating gate technologyR = 65 nm, MirrorBit technology
XX pSRAM Density 04 = 4Mbit SRAM08 = 8Mbit SRAM0A = 16Mbit pSRAM40 = 4Mbit pSRAM80 = 8Mbit pSRAMA0 = 16Mbit pSRAMB0 = 32Mbit pSRAMC0 = 64Mbit pSRAMD0 = 128Mbit pSRAM
XX Package Type B = FBGAC = CSOP (Lead Frame)D = Die (Die/Wafer)E = Super CSP (BGA)F = Fortified BGAM = SOIC/SOP (Lead Frame)N = WSON (Lead Frame)T = TSOPS = SOPH = MCP FBGAK = POP FBGAJ = MCP FBGAZJ = Very thin fine-pitch BGA lead-free LF35 package
X Package Material Set BlankA = Standard, not lead (Pb)-freeF = Standard, lead (PB)-free
X Temperature Range BlankE = Engineering samplesC = Commercial (0°C to 70°C)W = Wireless (-25°C to 85°C)I = Industrial (-40°C to 85°C)N = Extended (-40°C to 125°C)
X Package Modifier Blank0, Q = 7x9mm, 1.2mm height, 56 balls9 = 8x11.6mm, 1.2mm height, 64 ballsT = 8x11.6mm, 1.4mm height, 84 ballsA = 8x11.6mm, 1.2mm height, 84 ballsE = 9x12mm, 1.2mm height, 84 ballsY = 9x12mm, 1.2mm height, 84 ballsK = 7.7x6.2mm, 56-Ball
X Model Number 1 BlankH = CellularRAM type 2, DYB=1, PPB=0S = CellularRAM type 2, DYB=1, PPB=1T = CellularRAM type 3, DYB=1, PPB=14 = SDR DRAM x16, Type 5
X Model Number 2 BlankV = 66MHz flash speedR = 80Mhz flash speedL = 108MHz flash speed
X Packing Type 0Tray1 = Tube2 = 7\\\'\\\' Tape & Reel3 = 13\'\' Tape & Reel

Poznámka: Tabuľka popisu čísla dielu popisuje bežný systém číslovania dielov pre viac čipov, preto môže táto tabuľka obsahovať informácie, ktoré nemusia byť platné pre aktuálne vybraný čip. Tu uvedené informácie sú poskytované na základe maximálneho úsilia a môžu byť nepresné alebo neúplné. Preto vždy skontrolujte najnovší technický list čipu, kde nájdete detailný popis čísla dielu. Ak nájdete nejakú nepresnosť, dajte nám vedieť.

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Podporovaný programátormi a programovacími adaptérmi/modulmi:

BeeHive204 adaptér/modul: BGA-0439/0446 (70-0439/0446) = BGA-Bottom-30 (70-0439) + BGA-Top-48 ZIF (70-0446)
BeeHive204AP adaptér/modul: AP1 BGA-0439/0446 (71-2113)
BeeHive208S adaptér/modul: BGA-0439/0446 (70-0439/0446) = BGA-Bottom-30 (70-0439) + BGA-Top-48 ZIF (70-0446)
BeeProg2 adaptér/modul: BGA-0439/0446 (70-0439/0446) = BGA-Bottom-30 (70-0439) + BGA-Top-48 ZIF (70-0446)
BeeProg2AP adaptér/modul: AP1 BGA-0439/0446 (71-2113)
BeeProg2C adaptér/modul: BGA-0439/0446 (70-0439/0446) = BGA-Bottom-30 (70-0439) + BGA-Top-48 ZIF (70-0446)
BeeHive204AP-AU (prestala byť podporovaná) adaptér/modul: AP1 BGA-0439/0446 (71-2113)
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