CC = Embedded RF radioMSP = Mixed signal processorXMS = Experimental silicon
XXX
MCU Platform
430 = TI's low power microcontroller platform
X
Device Type
Memory type:C = ROMF = FlashFR = FRAMG = Flash (Value line)L = No nonvolatile memorySpecialized application:AFE = Analog front endBT = Preprogrammed with bluetoothBQ = Contactless powerCG = ROM medicalFE = Flash energy meterFG = Flash medicalFW = Flash electronic flow meter
X
Series
1 series = Up to 8MHz2 series = Up to 16MHz3 series = Legacy4 series = Up to 16MHz w/ LCD5 series = Up to 25MHz6 series = Up to 25MHz w/ LCD0Low voltage series
XXX
Feature Set
various levels of integration within a series
X
Revision
N/A
X
Temperature Range
S = 0°C to 50°CC = 0°C to 70°CI = -40°C to 85°CT = -40°C to 105°C
XXX
Packaging
www.ti.com/packaging
X
Tape And Reel
T = Small reel (7 inch)R = Large reel (11 inch)No markings = Tube or Tray
XX
Additional Features
EP = Enhanced product (-40°C to 105°C)HT = Extreme temperature (-55°C to 150°C)
Poznámka: Tabuľka popisu čísla dielu popisuje bežný systém číslovania dielov pre viac čipov, preto môže táto tabuľka obsahovať informácie, ktoré nemusia byť platné pre aktuálne vybraný čip. Tu uvedené informácie sú poskytované na základe maximálneho úsilia a môžu byť nepresné alebo neúplné. Preto vždy skontrolujte najnovší technický list čipu, kde nájdete detailný popis čísla dielu. Ak nájdete nejakú nepresnosť, dajte nám vedieť.
