Obvod: THGBM4G8D4GBAIE [TFBGA169]
Výrobca: Toshiba
Popis označenia obvodu: |
TH X X X X XX X X X XX X X |
| Nabehnutím kurzora zvýraznite konkrétnu sekciu. |
| TH | Toshiba Hybrid IC | |
| X | Type Of Flash | |
| X | Voltage Type | B = Vcc=3.3V, VccQ=3.3V or 1.8V |
| X | NAND Interface | M = e-MMC type |
| X | Controller Revision | |
| XX | Memory Density | G6 = 64Gbit |
| X | NAND Cell Level | C = 4LC |
| X | Number Of Stacked NAND Chip/Package | |
| X | NAND Design Rule | L = 15nm |
| XX | Package Type | BA = BGA |
| X | Temperature Range | I = -25°C to 85°C |
| X | Package Size | L = 11.5x13x.0.8mm |
Podporovaný programátormi a programovacími adaptérmi/modulmi:
| BeeHive204 | adaptér/modul: BGA-Bottom-165 (70-1009) + BGA-Top-193 ZIF-CS (a) (70-1010A) OR BGA-Bottom-165 (70-1009) + BGA-Top-299 ZIF (a) (70-2811A) |
| BeeHive204AP | adaptér/modul: AP1 BGA169-1.01 eMMC-1 (71-3193) |
| BeeHive208S | adaptér/modul: BGA-Bottom-165 (70-1009) + BGA-Top-193 ZIF-CS (a) (70-1010A) OR BGA-Bottom-165 (70-1009) + BGA-Top-299 ZIF (a) (70-2811A) |
| BeeHive304 | adaptér/modul: AP3 BGA169-1.01 eMMC-1 (73-3043) |
| BeeProg2 | adaptér/modul: BGA-Bottom-165 (70-1009) + BGA-Top-193 ZIF-CS (a) (70-1010A) OR BGA-Bottom-165 (70-1009) + BGA-Top-299 ZIF (a) (70-2811A) |
| BeeProg2AP | adaptér/modul: AP1 BGA169-1.01 eMMC-1 (71-3193) |
| BeeProg2C | adaptér/modul: BGA-Bottom-165 (70-1009) + BGA-Top-193 ZIF-CS (a) (70-1010A) OR BGA-Bottom-165 (70-1009) + BGA-Top-299 ZIF (a) (70-2811A) |
| BeeProg3 | adaptér/modul: AP3 BGA169-1.01 eMMC-1 (73-3043) |
| BeeHive204AP-AU (discontinued) | adaptér/modul: AP1 BGA169-1.01 eMMC-1 (71-3193) |
