PG4UW, OnDemand version of software for Beeprog3/BeeHive304 programmers.

List of changes (added devices, device handling improvements, fixed bugs)
against regular version of software.

-------------------------------------------------------------------------

3.51z01/08.2019 (22.08.2019)
- added support: Macronix MX30LF2G28AD [TSOP48], MX30LF2G28AD [VFBGA63]
- added support: Micron MT29F16G08ABCBBH1-12AIT [VBGA100], MT29F16G08ABCCBH1-10 [VBGA100], 
  MT29F16G08ABCCBH1-10IT [VBGA100], MT29F16G08ABCCBH1-10Z [VBGA100], MT29F16G08ABCCBH1-10ITZ [VBGA100],
  MT29F32G08ABCABH1-10 [VBGA100], MT29F32G08ABCABH1-10IT [VBGA100], MT29F32G08ABCABH1-12 [VBGA100], 
  MT29F32G08ABCABH1-12IT [VBGA100]
- added module: AP3 BGA100-9 NAND-1 (73-5242)
- AP3 BGA162-2.10 NAND-1 (73-4891), support modified

3.51z/08.2019 (20.08.2019)
- added support: Dosilicon DSND8G08S3N [FBGA63]

3.51y/08.2019 (16.08.2019)
- added support: Dosilicon FMND4G08S3C [FBGA63], DSND8G08S3M [FBGA63]

3.51x/08.2019 (14.08.2019)
- added support: Cypress S25FS512SxxMxx01 [SO16] (QuadSPI)
- added support: Dosilicon FMND4G08S3B [FBGA63], FMND4G08U3C [FBGA63]
- added support: Panasonic C3FB1Y000073, C3FB1Y000073 (PAN-03)
- added support: Renesas R7F7015873AFP
- added support: Spansion S25FS512SxxMxx01 [SO16] (QuadSPI)
- added support: Toshiba THGBMJG6C1LBAIL [WFBGA153], THGBMJG6C1LBAIL [WFBGA153] (PAN-03)

3.51w/08.2019 (12.08.2019)
- added support: Dosilicon FMND4G08U3B [FBGA63]
- Cypress S6J3x devices, modification of programming commands timing

3.51v/08.2019 (09.08.2019)
- added support: Dosilicon FMN1ET1TCB-xxxH [FBGA162]

3.51u/08.2019 (08.08.2019)
- added support: FORESEE FS33ND02GH208 [BGA63]
- added support: Renesas uPD78F1026 [TQFP64]
- FORESEE FS33NDxxxxxxx, partnames simplified (irrelevant characters omitted)

3.51t/08.2019 (07.08.2019)
- internal improvements

3.51s/08.2019 (06.08.2019)
- added support: Atmel/Microchip ATSAMDA1G16B [TQFP48]
- added support: GigaDevice Semic. GD25LQ64C [TSOP8-208]
- added support: Micron N25Q512A81G [SO16W] (Quad I/O)
- Cypress S6J328CLxxxx [TEQFP216], power-up sequence modified

3.51r/08.2019 (01.08.2019)
- added support: NXP NCF29A3 (8kB EROM) [HVQFN32], NCF29A3 (24kB EROM) [HVQFN32], NCF29A3 (32kB EROM) [HVQFN32]
- change name from NXP NCF29A3 [HVQFN32] to NCF29A3 (16kB EROM) [HVQFN32]

3.51q/07.2019 (30.07.2019)
- internal improvements

3.51p/07.2019 (29.07.2019)
- added support: TI (TMS) MSP430FR2512 [VQFN20](JTAG), MSP430FR2512 (ISP-4wire JTAG)

3.51o/07.2019 (23.07.2019)
- added support: TI(TMS) TPS65400
- added module: AP3 QFN48-1.02 TPS-1 (73-5271)

3.51n/07.2019 (19.07.2019)
- module AP3 QFP100-1.02 R7F-2 (ord.no. 73-4662), AutomaticYes! bug fixed
- update support: XTSD01GLGxxx [LGA8], XTSD02GLGxxx [LGA8], XTSD04GLGxxx [LGA8], XTSD08GLGxxx [LGA8]

3.51m/07.2019 (18.07.2019)
- added support: STMicroelectronics STM32F479BIT [LQFP208]
- added module: AP3 QFP208-1.02 STM32-DSI-1 (73-5119)
- Lattice M4A5-128/64, improving of power up sequence, ID check error fixed

3.51k/07.2019 (17.07.2019)
- added support: Microchip SST26VF032B [SOIC8]
- Renesas R7F701400 [LQFP100], algorithm modification

3.51j/07.2019 (16.07.2019) .. 3.51h/07.2019 (12.07.2019)
- internal improvements

3.51g/07.2019 (11.07.2019)
- Silicon Laborat. C8051F353 [QFN28], insertion test bug fixed

3.51f/07.2019 (10.07.2019)
- added support: Toshiba THGBMJG7C2LBAU8 [TFBGA153]
- Atmel/Microchip ATSAMG55 series, Power-Up sequence modified

3.51e/07.2019 (08.07.2019)
- added support: Biwin BWCTASC21G08G [LFBGA153]
- added support: Micron MT25QU128ABA1E [SO8W] (Quad I/O)

3.51d/07.2019 (04.07.2019)
- internal improvements

3.51c/07.2019 (03.07.2019)
- added support: STMicroelectronics STM32F410C8T [LQFP48], STM32F410CBT [LQFP48]
- Spansion S98FL512SxxMxxG0 [SO16] (Dual-Quad I/O), improving of overcurrent protection system
- Overcurrent report improvement

3.51b/07.2019 (02.07.2019)
- added support: Dosilicon FMN1SD5SBB-xxxA [FBGA130]
- added support: Macronix MX25L3233F [SOP16] (Quad I/O)
- Fidelix/Dosilicon MCP NAND flash devices FMNxxxxxxx in BGA107, BGA130 and BGA137, package suffix added to
  part names to distinguish various versions of the same ball-count package
  
3.51a/06.2019 (28.06.2019)
- added support: Dosilicon FMN4ET2TCK-xxxH [FBGA162]
- added support: FORESEE FS33ND04GS108BFI0 [BGA63]
- Lattice LC4256V [TQFP144], insertion test bug fixed