PG4UW, OnDemand version of software for Beeprog3/BeeHive304 programmers. List of changes (added devices, device handling improvements, fixed bugs) against regular version of software. ------------------------------------------------------------------------- 4.06u/11.2025 (11.11.2025) - Renesas R5F10266xSP [SSOP20], fixed configuration bit setting error 4.06t/11.2025 (10.11.2025) - Cypress CYT3DLABABQ1AESGS [TEQFP216], programming algorithm modified 4.06s/11.2025 (07.11.2025) - added support: ISSI IS25LP256D-JH [TFBGA24] (Quad I/O), IS25LP256D-JH [TFBGA24] - NAND flash devices, custom invalid block indication options acceptance fixed 4.06r/11.2025 (06.11.2025) - internal improvements 4.06q/11.2025 (05.11.2025) - added support, Winbond W25Q64JWTBxQ [TFBGA24 6x8] (QuadSPI) - STMicroelectronics SPSB100G [VFQFN56], reserved bits handling modification 4.06p/10.2025 (31.10.2025) - added support: ATP Electronics AF128GEC5A-2001xx [FBGA153] - added support: Renesas R5F56604xxFP, R5F56609xxFP - added module: AP3 QFP100-1.02 R5F-25 (73-7325) - Infineon S28HS01GTGZBxx03 [BGA24] (Octal I/O), added SafeBoot recovery operation - Infineon S28HS512TGABxx01 [BGA24] (Octal I/O), added SafeBoot recovery operation 4.06o/10.2025 (30.10.2025) - Panasonic 'C2DBYY001934 [LFQFP80] Boot mode', 'C2DBYY002081 [LFQFP80] Boot mode' option area programming modified - Renesas RX66T group option area programming in boot mode modified 4.06n/10.2025 (29.10.2025) - Panasonic 'C2DBYY001934 [LFQFP80] Boot mode', 'C2DBYY002081 [LFQFP80] Boot mode' option area programming modified - Renesas RX66T group option area programming in boot mode modified 4.06m/10.2025 (28.10.2025) - added support: STMicroelectronics SPSB100G [VFQFN56] - added module: AP3 QFN56-2.02 PMIC-5 (73-7302) 4.06k/10.2025 (24.10.2025) - internal improvements 4.06j/10.2025 (23.10.2025) - added support: Cypress FL256SAIH20 [BGA24] - added support: Infineon FL256SAIH20 [BGA24] - added support: Spansion FL256SAIH20 [BGA24] - added new remote control commands to remotelb.dll: SEND_CMD_LoadFileWithOffset SEND_CMD_LoadFileWithOffset_CINDEX 4.06i/10.2025 (22.10.2025) .. 4.06h/10.2025 (21.10.2025) - internal improvements 4.06g/10.2025 (20.10.2025) - Microchip PIC32MKxxxxMCM/GPK, modification of programming the Configuration bits 4.06f/10.2025 (17.10.2025) - AP3 BGA484-1 PLD-2 (73-3836), interface update 4.06e/10.2025 (16.10.2025) - added support: UNIM UM19A2LISW [WSON8] 4.06d/10.2025 (15.10.2025) - added support: UNIM UM19A8HISW [WSON8] 4.06c/10.2025 (14.10.2025) - added support: UNIM UM19A8LISW [WSON8] - special unprotect before erase for Renesas Synergy device when programming OEM certificate failed modified 4.06b/10.2025 (13.10.2025) - added support: Winbond W29N08LWBxBG [VFBGA63] 4.06a/10.2025 (10.10.2025) - added support: Winbond W25X20CV [USON8] (DualSPI), W25X20CV [USON8] - added support: Winbond W29N04LWBxBG [VFBGA63] - Winbond W29N04LZBxBG [VFBGA63], W29N08LZBxBG [VFBGA63], OTP support added