PG4UW, OnDemand version of software for Beeprog3/BeeHive304 programmers. List of changes (added devices, device handling improvements, fixed bugs) against regular version of software. ------------------------------------------------------------------------- 4.11y/05.2026 (15.05.2026) - added support: NXP/Freescale Semic. MC56F82723 [QFN32], MC56F82733 [QFN32] MC56F82743 [QFN32], MWCT1012 [QFN32] - added support: STMicroelectronics STM32H563MIYxQ [WLCSP80], STM32H573MIYxQ [WLCSP80] - added module: AP3 QFN32-1.02 MC56F-1 (73-7510) - added module: AP3 WLCSP80-4 STM32H5-1 (73-7028) 4.11x/05.2026 (14.05.2026) - added support: UCUN Technology UC25WD40xBE [USON8 3x2] (Dual O), UC25WD40xBE [USON8 3x2] 4.11w/05.2026 (13.05.2026) - added module: AP3 BGA272-1 R5F-1 (73-7505) 4.11v/05.2026 (12.05.2026) - added module: AP3 QFP100-1.02 H8-1 (73-4014) - added module: AP3 QFP100-2.03 R5F-1 (73-3900) - added support: KOWIN KASH6311 [FBGA153] - added support: TWSC TEMBG104T10-A0S5 [BGA153] - added support: TDSEMIC 25Q32-TD [SOP8-208] (QuadSPI), 25Q32-TD [SOP8-150] (QuadSPI), 25Q16-TD [SOP8-208] (QuadSPI), 25Q16-TD [SOP8-150] (QuadSPI) 4.11u/05.2026 (11.05.2026) - added support: Giantec Semicond. GT25Q128EZ-H [SOP8-208] (QuadSPI), GT25Q64EZ-H [SOP8-150] (QuadSPI) - added support: GigaDevice GD25LE64E [USON8 4x4] (QuadSPI) - added support: Renesas R7FA2E305xxFJ, R7FA2E307xxFJ - added support: TI (TMS) TPS546E25 - added module: AP3 QFP32-1.04 R7FA-1 (73-7061) - added module: AP3 QFN37 TPS546-1 (73-7493) 4.11t/05.2026 (07.05.2026) - added support: Biwin BWEFMA008GN9RE [FBGA153] - added support: HeYangTek HYF4GQ4UAACAE [WSON8] - added support: Macronix MX66U1G45GXDx54 [BGA24] (Quad I/O) - added support: Puya Semiconductor PY25Q129HA [SOP8-200] (Quad I/O) - added support: Puya Semiconductor PY25Q129HA [SOP8-200] - AP3 BGA256-3 PLD-21 (73-3851), interface update 4.11s/05.2026 (06.05.2026) - added support: Infineon CYBT-413061-02 - added support: SiliconGo SGM8200I-Y18BCG [FBGA153] - added support: STMicroelectronics STM32U375RGT [LQFP64], STM32U375RGTxQ [LQFP64], STM32U385RGTxQ [LQFP64] - added support: Winbond W25Q20RVxxxQ - added module: AP3 module CYBT-4130 (73-7487) 4.11r/05.2026 (04.05.2026) - internal improvements 4.11q/04.2026 (30.04.2026) - added support: Toshiba TC58NVG3S0ETAI0 [TSOP48] - added support: Winbond W25N04LVCExG [WSON8] 4.11p/04.2026 (29.04.2026) - added support: Lattice LCMXO3LF-640E [TQFP100] 4.11o/04.2026 (27.04.2026) - added support: Winbond W25Q64JWxxxM [WSON8 6x5] (QuadSPI) - Cypress S28HS01GTGZBxx03 [BGA24] (Octal I/O), ID check improved - Infineon S28HS01GTGZBxx03 [BGA24] (Octal I/O), ID check improved 4.11n/04.2026 (24.04.2026) - added support: Laird BL652-SA-01 4.11m/04.2026 (23.04.2026) - added module: AP3 QFN32-1.02 MAX-2 (73-6446) - added support: Analog Devices/Maxim MAX25221 4.11k/04.2026 (22.04.2026) - added module: AP3 QFN32-1.02 RTQ-1 (73-7491) - added support: KIOXIA THGAMSG9T15BAIL [WFBGA153] (PAN-03) - added support: Rayson RS70B64G4M08G [TFBGA153] (PAN-03) - added support: Richtek RTQ6749-QT-A2 4.11j/04.2026 (21.04.2026) - added support: Kingston Tech. EMMC64G-TY29-PA5B-DL [FBGA153] (unvfy) - added support: KIOXIA THGAMSG9T15BAIL [WFBGA153] - added support: Rayson RS70B64G4M08G [TFBGA153] - added support: STMicroelectronics STM32U5F7VJT [LQFP100] - Cypress S28HS01GTGZBxx03 [BGA24] (Octal I/O), programming procedure improved 4.11i/04.2026 (20.04.2026) - internal improvements 4.11h/04.2026 (17.04.2026) - added support: Alliance Memory AS25F3128MQ [SOP8-208] (QuadSPI) - added support: Winbond W25Q40RLxxxQ [SOIC8-150] (QuadSPI) - Infineon S28HS01GTGZBxx03 [BGA24] (Octal I/O), power-down sequence improved 4.11g/04.2026 (16.04.2026) - internal improvements 4.11f/04.2026 (15.04.2026) - internal improvements 4.11e/04.2026 (14.04.2026) - added support: Phison PTE4A0SV-X28E [FBGA153] - Infineon S28HS01GTGZBxx03 [BGA24] (Octal I/O), power-up sequence improved - ISSI IS25WP040E-J [USON8 2x3] (Quad I/O), stability of reading/verifying device improved - Nordic nRF9160-SICA-B1A [LGA127] (modem), programming procedure modified 4.11d/04.2026 (13.04.2026) - added module: AP3 QFP64-1.02 CY-1 (ord.no. 73-5321) - added support: Cypress CY8C4147AZS-S285 [TQFP64], Infineon CY8C4147AZS-S285 [TQFP64] - added support: XTX XT27Q08ABS [TFBGA63] - Winbond W25H512JVxxM-DTR, Alt+S menu improved 4.11c/04.2026 (10.04.2026) - added support: ESMT EN25QT64A(2E) [SOP8-150] (QuadSPI), EN25QT64A(2E) [SOP8-208] (QuadSPI), EN25QT64A(2EC) [SOP8-150] (QuadSPI), EN25QT64A(2EC) [SOP8-208] (QuadSPI) - added support: Microchip PIC16F18155 - added support: Zbit Semiconductor ZB25VQ32E [SOP8-208] (QuadSPI), ZB25LQ64A [SOP8-208] (QuadSPI), ZB25VQ128D [SOP8-208] (QuadSPI) - added support: GSTO GSS02GSBX1-W8NM [WSON8] 4.11b/04.2026 (09.04.2026) - added support: Macronix MX25L51243Gxx40 [SOP16] (Quad I/O) - added support: Renesas R7FA6M3AFxxBG, R7FA6M3AHxxBG - added module: AP3 BGA176-1.1 R7FA-1 (73-6205) 4.11a/04.2026 (08.04.2026) - added support: Winbond W25Q16JVxxxM-DTR [USON8 2x3], W25Q16JVxxxM-DTR [USON8 4x3], W25Q16JVxxxM-DTR [VSOP8-200], W25Q16JVxxxM-DTR [WSON8 6x5]