PG4UW, OnDemand version of software. List of changes (added devices, device handling improvements, fixed bugs) against regular version of software. ------------------------------------------------------------------------- 3.41q/06.2018 (21.06.2018) - Microchip PIC16F690 (ISP), programing speed modified - Winbond W25Q64JVxxxQ, Verifying Status Register - error! fixed 3.41p/06.2018 (20.06.2018) - added support: Analog Devices ADUCM362 [LFCSP48] (SWD) - added support: Cypress/Spansion S34MS04G200Txx00 [TSOP48], S34MS01G204Txx01 [TSOP48] - added adapter: DIL48/QFP48-1.02 ZIF LPC-3 (ord.no. 70-3483) - added module: AP1 QFP100-1 ZIF NEC-11 (ord.no. 71-1611) - Realtek RTL8762A, programming improved 3.41o/06.2018 (15.06.2018) - added support: Cypress/Spansion S34MS01G200Gxx00 [BGA67] - added support: Cypress/Spansion S34MS16G202Bxx00 [BGA63] - added support: Intersil ISL69138 3.41n/06.2018 (14.06.2018) - added support: XMC XM25QH40B, XM25QU40B, XM25QU20B - added module AP1 BGA256-0491/0453 (ord.no. 71-2110) - added module AP1 BGA256-0678/0453 (ord.no. 71-2105) - added module AP1 BGA332-1 ZIF PLD-1 (ord.no. 71-4851) - Microchip PIC32MX360F512L (2wire JTAG), initialization procedure improved 3.41m/06.2018 (13.06.2018) - added support: Cypress/Spansion S34ML04G204Bxx01 [BGA63] - added support: GigaDevice GD25LQ32D [USON8 4x3] - added support: Jeju Semiconductor JS27HU1G08SC [FBGA63] - added support: LRC LR25D40S [SOP8-150], LR25Q32S [SOP8-200], LR25Q32S [SOP8-150],LR25Q64S [SOP8-200] - added support: Toshiba TC58CYG0S3HRAIG [WSON8] - added support: Winbond W25Q32JWxxxQ (QuadSPI) - Microchip PIC16F690 (ISP), power-up procedure modified - updated remote control examples MultiDemo.VB.NET - removed log file path forcing from command line - added more detailed error messages for some catched exceptions - improved Automatic YES! "not connected pins" list obtained by Automatic YES! wizard to correctly save/load the list to/from project files 3.41k/06.2018 (08.06.2018) - added support: Cypress/Spansion S34MS01G200Txx00 [TSOP48] - added support: Winbond W29N02GZSxBA [TSOP48] - added adapter: DIL48/QFN48 ZIF ARM-1 (ord.no. 70-1345) - added module AP1 BGA484-1 ZIF PLD-9 (ord.no. 71-4837) - Altera EPCS1 [SOIC8], Verifying device - error! fixed - AP3 SOIC16-300 SFlash-1 (73-3036), modul became discontinued - KHIC KH25L6436F (ISP), supported as 'Paid ISP support' - Macronix KH25L6436F (ISP), MX25L6436F (ISP), supported as 'Paid ISP support' - Silicon Laborat. EFR32xG13xxx devices, added erase option "Unlock Debug access" 3.41j/06.2018 (06.06.2018) - added support: Etron Technology EM73C044SNC [WSON8], EM73E044SNB [WSON8] - added support: Etron Technology EM78C044SNC [WSON8], EM78E044SNB [WSON8] - added support: Freescale MK70FN1M0xxx12 (ISP-EZP), MK70FN1M0xxx15 (ISP-EZP) - added support: ISSI IS29GL256xxDxxB [FBGA64] - added support: Winbond W25Q32JVxxxQ [SOIC8-150] (QuadSPI) - Dallas/maxim DS28E01-100, insertion test bug and pull-up voltage bug fixed. - Microchip PIC32MZ2048EFM144 [TQFP144](2wire JTAG), programming bug fixed 3.41i/06.2018 (04.06.2018) - added support: Cypress CY8CLED01D01, CY8CLED01D01 (ISP), CY8CLED02D01, CY8CLED02D01 (ISP) - added support: TI(TMS) CC1312R1F3 [QFN48], CC2642R1F [QFN48] - added module: AP1 TSOP32 ZIF 12.4mm NOR-2 (ord.no. 71-1976) - added module: XMC XM25QU256B [WSON8 8x6] (QuadSPI), XM25QH256B [SOP16] (QuadSPI) 3.41h/05.2018 (31.05.2018) - added support: Lattice/Vantis M5-512/160 [PQFP208], MLV5-512/160 [PQFP208] - added support: Vantis M5-512/160 [PQFP208](SVF), MLV5-512/160 [PQFP208](VME) - Inside Secure/WiseKey AT90SCR200H [QFN64], incorrect package drawing corrected - Lattice M5-512/160 [PQFP208], improving of pgm parameters assignment 3.41g/05.2018 (30.05.2018) - added support: FORESEE FS25Q064F2 [SOP8-200] (Quad I/O), FS25Q064F2 [SOP8-200] - Microchip PIC24HJ128GP204 [QFN44], Insertion test bug fixed 3.41f/05.2018 (29.05.2018) - added support: Cypress/Spansion S34ML04G300Bxx00 [BGA63], S34ML04G300Txx00 [TSOP48] - added support: Inside Secure/WiseKey AT90SCR200H [QFN64] - Atmel/Inside Secure/WiseKey AT90SCR100H [QFN64], IDcheck and Erase procedure modified - Freescale MKL17Z256 device size bug fixed - Silicon Laborat. EFR32xG13xxx devices, change the process of programming Lock Bits Page - Winbond W25Q64FWxxxQ [SOIC8] (QuadSPI), added support on AP programmers 3.41e/05.2018 (25.05.2018) - Freescale MKL17Z256 [MAPBGA64] inicialization modified - Micron M25P40-V [UFDFPN8 2x3], added support for BeeHive204 and BeeHive208S - Numonyx M25P40-V [UFDFPN8 2x3], added support for BeeHive204 and BeeHive208S - TI (TMS) CC2541F128, programming procedure improved - TI (TMS) MSP430Fxxx, test blank DCO/TLV data bug fixed - Toshiba TMPM383FWUG, PowerOn and PowerOff sequence bug fixed 3.41d/05.2018 (23.05.2018) - added support: Fudan FM25Q04 [TSSOP8] - added support: GigaDevice Semic. MD25Q16C [SOP8-150] - added module AP1 QFN48-1.02 ZIF EFM-1 (ord.no. 71-4828) - added module AP1 TSSOP10-170 ZIF R5F-1 (ord.no. 71-4839) - Lattice LC4128V [TQFP100], improving of pgm parameters assignment - Micron/Numonyx/STMicroelectronics M29W128GLxxN [TSOP56], power-on/off procedure modified 3.41c/05.2018 (22.05.2018) - added support: ISSI IS25LP512M-RM [SOIC16] (Quad I/O), IS25LP512M-RM [SOIC16] - Giantec Semicond. GT93C86, programming bug fixed - fixed in dialog Create problem report: texts for eastern-asian languages are now displayed correctly 3.41b/05.2018 (21.05.2018) - added support: Fudan FM25W02 - added support: Macronix MX66L25685G [SOP16] (Dual-Quad I/O) - added support: Toshiba TMPM470FDFG [LQFP100] 3.41a/05.2018 (18.05.2018) - added support: XMC XM25QH80B - added adapter: BGA-Top-366 ZIF-CS (ord.no. 70-3444) - Vantis M5-512/160 [PQFP208], MLV5-512/160 [PQFP208], access violation bug fixed - Winbond W25Q128FWxxxG, verify status register bug fixed - Winbond W25Q16FWxxxQ, programming adapter bug fixed - Winbond W25Q128FVxxx, verify status register bug fixed