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HOME » Products » Device Programmers » Socket Converters » BGA-0289 0287

BGA-0289/0287

BGA-0289/0287
(ord.no. 70-0289/0287)

See: Converter manual | Accepted package(s) | Useable for programmer(s)

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special converter, assigned for memories in BGA package, for example Intel 28F160,320 family in FBGA48
top board: BGA-Top-21 ZIF-CS (order no. 70-0287)
bottom board: BGA-Bottom-5 (order no. 70-0289)
ZIF socket accepts many variations of BGA packages, that differ in ball diameter, ball width and package thickness.
The picture at Accepted package(s) section shows the range of all dimensions of BGA packages, which are accepted by this BGA-Top board.
operation (mechanical) life of ZIF socket - 500.000 actuations
made in Slovakia

Ord. no	70-0289/0287
Socket	ZIF BGA48 (depopulated array of (48) spring probes), ClamShell type
Bottom	2 rows, 2x 24 pins, square, 0.6x0.6mm, rows spacing 600mil
Class	BGA/LGA
Subclass	BGA converters
Availability in stock	0 [14] / 0 [5]

Converter manual

Insert converter to the device programmer ZIF socket according to the picture placed near of it. If you have some doubts about orientation of this converter in device programmer ZIF socket, it is valid general rule, the orientation of the text of title is the same as the text on the top of the device programmer.
Open the converter ClamShell ZIF socket. Insert the device into it (place device on contacts). The right position of the programmed device in converter ZIF socket is show on the picture in control program PG4UW (Device info <Ctrl+F1> for selected device).
Visually check position of device in converter ClamShell ZIF socket. If everything looks OK, close it and now, device is ready for programming.
Be careful, because the incorrect insertion of converter to the device programmer ZIF socket or device to the converter ClamShell ZIF socket can damage the programmed device.
To take out the device, open converter ClamShell ZIF socket and remove device from it.
When you finish work with converter, remove it from the device programmer ZIF socket.
Do not directly touch the pins of the converter and converter ZIF socket, because dirt may cause errors during programming of device.
For handling with the device we recommended to use a vacuum pick up tool.
The picture show, how to put together the BGA-Top-x ZIF-CS and BGA-Bottom-x boards to have complete BGA converter

Software note

If software version, you're using currently, doesn't contain support for this programming adapter, please download the latest version of software - Regular or OnDemand - from our web site.

Accepted package(s)

BGA package

NAME	SYMBOL	MIN	NOM	MAX
Profile	A	-	-	1
Ball Height	A1	0.15	-	-
Body Thickness	A2	-	0.665	-
Ball Diameter	b	0.325	0.375	0.425
Body Size	D	7.186	7.286	7.386
Body Size	E	6.864	6.964	7.064
Ball Pitch	e	-	0.75	-
Ball Array D	GD	-	8	-
Ball Array E	GE	-	6	-

The names of the programmable devices don't contain all characters, shown at the top of the chip or mentioned in the datasheet section part numbering. The names contain all characters necessary to identification of the device, but don't contain such codes, that have none influence to the programming, for example temperature code, speed code, packing type code, etc. . If such code letter is at the end of the name, is omitted, if such code letter is in the middle of name, then is replaced by character 'x'.

Examples:

Devices Am27C512-150, Am27C512-200 and Am27C512-250 are shown in the software only once, as Am27C512
S29GL064N11TF1010 device is shown in the software as S29GL064NxxTxx01

This number characterize availability in stock within 3 days.

The sample of programmable devices is necessary to have for test and release new chip support.

In case of missed samples, we always asking the semiconductor manufacturer for samples, but if samples are not available - also in the package you're asking for the support - the solution from us will be delayed.

The real chips are also necessary to have in the case of reproducing issues from the created support. Therefore we can return your samples only if we get chips from semiconductor manufacturer.

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