See Elnec products at exhibitions:

Electronica India 2010

September 7-10 2010,
BIEC Bangalore, India
hall: Hall 2
stall no.: 2654
exhibitor: Hexaa Bytes Systems


Electronica 2010

November 9-12 2010,
New Munich Trade Fair, Germany
hall: Hall A6
booth no.: Booth 146
exhibitor: Elnec s.r.o.

BGA-Bottom-24

BGA-Bottom-24
(ord.no. 70-0418)

See: Converter manual | Accepted package(s)

WARNING: BGA-Bottom-24 [70-0418] is discontinued product! Please go to discontinued products section to find the replacement.

  • bottom board of BGA converters, assigned for Flash devices with balls in matrix 12x8
  • made in Slovakia
Ord. no 70-0418
Socket 4 rows, sockets for 4x 25 wire wrap pin
Bottom 2 rows, 2x 24 pins, square, 0.6x0.6mm, rows spacing 600mil
Class BGA/LGA
Subclass BGA-Bottom
Converter manual
  • For work with BGA device it is necessary put together BGA-Bottom-24 with some BGA-Top-x ZIF-CS board according the information provided by PG4UW software.
  • Do not directly touch the pins of the converter, because dirt may cause errors during programming of device.
  • The picture show, how to put together the BGA-Top-x ZIF-CS and BGA-Bottom-x boards to have complete BGA converter

Software note
  • If software version, you're using currently, doesn't contain support for this programming adapter, please download the latest version of software - Regular or OnDemand - from our web site.