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BGA-Top-152 ZIF-CS

BGA-Top-152 ZIF-CS
(ord.no. 70-0825)

See: Converter manual | Accepted package(s)
  • top board of BGA converters
  • ZIF socket accepts many variations of BGA packages, that differ in ball diameter, ball width and package thickness.
  • The picture at Accepted package(s) section shows the range of all dimensions of BGA packages, which are accepted by this BGA-Top board.
  • operation life of ZIF socket - 500.000 actuations
Ord. no 70-0825
Socket ZIF BGA107 (accept package up to 120 balls), Clamshell type
Bottom 8+3 rows, 8x25+3x20 pins, square, 0.6x0.6mm
Class BGA
Subclass BGA-Top
Availability in stock 1
Converter manual
  • For work with BGA device it is necessary put together BGA-Top-152 ZIF-CS with some BGA-Bottom-x board according to the information provided by PG4UW software.
  • Do not directly touch the pins of the converter, because dirt may cause errors during programming of device.
  • The picture show, how to put together the BGA-Top-x ZIF-CS and BGA-Bottom-x boards to have complete BGA converter

Software note
  • If software version, you're using currently, doesn't contain support for this programming adapter, please download the latest version of software - Regular or OnDemand - from our web site.
 
Accepted package(s)
BGA package Package
Design
NAMESYMBOLMINNOMMAX
ProfileA--1.4
Ball HeightA10.220.260.3
Body ThicknessA2---
Ball Diameterb0.410.460.51
Body SizeD-12-
Body SizeE-9-
Ball Pitche-0.8-
Ball Array DGD-12-
Ball Array EGE-10-
NAMESYMBOLMINNOMMAX
ProfileA11.11.2
Ball HeightA10.220.260.3
Body ThicknessA2---
Ball Diameterb0.410.460.51
Body SizeD11.91212.1
Body SizeE8.999.1
Ball Pitche-0.8-
Ball Array DGD-14-
Ball Array EGE-10-
NAMESYMBOLMINNOMMAX
ProfileA11.11.2
Ball HeightA10.220.260.3
Body ThicknessA2---
Ball Diameterb0.30.350.4
Body SizeD11.91212.1
Body SizeE8.999.1
Ball Pitche-0.8-
Ball Array DGD-14-
Ball Array EGE-10-