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HOME » Products » Device Programmers » Socket Converters » BGA-Bottom-24

BGA-Bottom-24

BGA-Bottom-24
(ord.no. 70-0418)

See: Converter manual | Accepted package(s)

WARNING: BGA-Bottom-24 [70-0418] is discontinued product! Please go to discontinued products section to find the replacement.

bottom board of BGA converters, assigned for Flash devices with balls in matrix 12x8
made in Slovakia

Ord. no	70-0418
Socket	4 rows, sockets for 4x 25 wire wrap pin
Bottom	2 rows, 2x 24 pins, square, 0.6x0.6mm, rows spacing 600mil
Class	BGA/LGA
Subclass	BGA-Bottom

Converter manual

For work with BGA device it is necessary put together BGA-Bottom-24 with some BGA-Top-x ZIF-CS board according the information provided by PG4UW software.
Do not directly touch the pins of the converter, because dirt may cause errors during programming of device.
The picture show, how to put together the BGA-Top-x ZIF-CS and BGA-Bottom-x boards to have complete BGA converter

Software note

If software version, you're using currently, doesn't contain support for this programming adapter, please download the latest version of software - Regular or OnDemand - from our web site.

The names of the programmable devices don't contain all characters, shown at the top of the chip or mentioned in the datasheet section part numbering. The names contain all characters necessary to identification of the device, but don't contain such codes, that have none influence to the programming, for example temperature code, speed code, packing type code, etc. . If such code letter is at the end of the name, is omitted, if such code letter is in the middle of name, then is replaced by character 'x'.

Examples:

Devices Am27C512-150, Am27C512-200 and Am27C512-250 are shown in the software only once, as Am27C512
S29GL064N11TF1010 device is shown in the software as S29GL064NxxTxx01

This number characterize availability in stock within 3 days.

The sample of programmable devices is necessary to have for test and release new chip support.

In case of missed samples, we always asking the semiconductor manufacturer for samples, but if samples are not available - also in the package you're asking for the support - the solution from us will be delayed.

The real chips are also necessary to have in the case of reproducing issues from the created support. Therefore we can return your samples only if we get chips from semiconductor manufacturer.

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