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HOME » Products » Device Programmers » Socket Converters » BGA-Top-51a ZIF-CS

BGA-Top-51a ZIF-CS

BGA-Top-51a ZIF-CS
(ord.no. 70-0417A)

See: Converter manual | Accepted package(s)

Price: $ 517.00 [read this!]
Price 4-7: $ 475.60
Price 8+ : Ask for price [?]

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top board of BGA converters
ZIF socket accepts many variations of BGA packages, that differ in ball diameter, ball width and package thickness.
The picture at Accepted package(s) section shows the range of all dimensions of BGA packages, which are accepted by this BGA-Top board.
operation (mechanical) life of ZIF socket - 500.000 actuations
made in Slovakia

Ord. no	70-0417A
Socket	ZIF BGA107 (depopulated array of (96) spring probes), ClamShell type
Bottom	4 rows, 4x 25 pins, square, 0.6x0.6mm
Class	BGA/LGA
Subclass	BGA-Top
Availability in stock	2

Converter manual

For work with BGA device it is necessary put together BGA-Top-51a ZIF-CS with some BGA-Bottom-x board according to the information provided by PG4UW software.
Do not directly touch the pins of the converter, because dirt may cause errors during programming of device.
The picture show, how to put together the BGA-Top-x ZIF-CS and BGA-Bottom-x boards to have complete BGA converter

Software note

If software version, you're using currently, doesn't contain support for this programming adapter, please download the latest version of software - Regular or OnDemand - from our web site.

Accepted package(s)

BGA package

NAME	SYMBOL	MIN	NOM	MAX
Profile	A	1.2	1.3	1.4
Ball Height	A1	0.27	0.32	0.37
Body Thickness	A2	-	-	-
Ball Diameter	b	0.4	0.45	0.5
Body Size	D	12.9	13	13.1
Body Size	E	10.4	10.5	10.6
Ball Pitch	e	-	0.8	-
Ball Array D	GD	-	14	-
Ball Array E	GE	-	10	-

NAME	SYMBOL	MIN	NOM	MAX
Profile	A	1	1.1	1.2
Ball Height	A1	0.27	0.32	0.37
Body Thickness	A2	-	-	-
Ball Diameter	b	0.4	0.45	0.5
Body Size	D	12.9	13	13.1
Body Size	E	10.4	10.5	10.6
Ball Pitch	e	-	0.8	-
Ball Array D	GD	-	14	-
Ball Array E	GE	-	10	-

NAME	SYMBOL	MIN	NOM	MAX
Profile	A	-	-	1.2
Ball Height	A1	0.25	-	-
Body Thickness	A2	-	0.8	-
Ball Diameter	b	0.4	0.45	0.5
Body Size	D	12.9	13	13.1
Body Size	E	10.4	10.5	10.6
Ball Pitch	e	-	0.8	-
Ball Array D	GD	-	14	-
Ball Array E	GE	-	10	-

NAME	SYMBOL	MIN	NOM	MAX
Profile	A	-	-	1.2
Ball Height	A1	0.21	0.26	0.31
Body Thickness	A2	-	-	-
Ball Diameter	b	0.4	0.45	0.5
Body Size	D	-	13	-
Body Size	E	-	10.5	-
Ball Pitch	e	-	0.8	-
Ball Array D	GD	-	14	-
Ball Array E	GE	-	10	-

NAME	SYMBOL	MIN	NOM	MAX
Profile	A	-	-	1.4
Ball Height	A1	0.21	0.26	0.31
Body Thickness	A2	-	-	-
Ball Diameter	b	0.4	0.45	0.5
Body Size	D	-	13	-
Body Size	E	-	10.5	-
Ball Pitch	e	-	0.8	-
Ball Array D	GD	-	14	-
Ball Array E	GE	-	10	-

NAME	SYMBOL	MIN	NOM	MAX
Profile	A	-	-	1.2
Ball Height	A1	0.25	-	-
Body Thickness	A2	0.84	0.85	0.86
Ball Diameter	b	-	0.45	-
Body Size	D	12.9	13	13.1
Body Size	E	10.4	10.5	10.6
Ball Pitch	e	-	0.8	-
Ball Array D	GD	-	14	-
Ball Array E	GE	-	10	-

NAME	SYMBOL	MIN	NOM	MAX
Profile	A	-	-	1.2
Ball Height	A1	0.3	0.35	0.4
Body Thickness	A2	-	-	-
Ball Diameter	b	0.4	0.45	0.5
Body Size	D	12.9	13	13.1
Body Size	E	10.4	10.5	10.6
Ball Pitch	e	-	0.8	-
Ball Array D	GD	-	14	-
Ball Array E	GE	-	10	-

The names of the programmable devices don't contain all characters, shown at the top of the chip or mentioned in the datasheet section part numbering. The names contain all characters necessary to identification of the device, but don't contain such codes, that have none influence to the programming, for example temperature code, speed code, packing type code, etc. . If such code letter is at the end of the name, is omitted, if such code letter is in the middle of name, then is replaced by character 'x'.

Examples:

Devices Am27C512-150, Am27C512-200 and Am27C512-250 are shown in the software only once, as Am27C512
S29GL064N11TF1010 device is shown in the software as S29GL064NxxTxx01

This number characterize availability in stock within 3 days.

The sample of programmable devices is necessary to have for test and release new chip support.

In case of missed samples, we always asking the semiconductor manufacturer for samples, but if samples are not available - also in the package you're asking for the support - the solution from us will be delayed.

The real chips are also necessary to have in the case of reproducing issues from the created support. Therefore we can return your samples only if we get chips from semiconductor manufacturer.

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