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Discontinued product! Please go to discontinued products section to find the replacement.

  • top board of BGA adapters
  • used ZIF socket may accept one or more variants of supported package, different in ball diameter, ball high and/or body thickness, see section Accepted package(s)
  • operating (mechanical) warranty of ZIF socket - 50,000 actuations
  • supported from PG4UW software version 3.24r,
    s/n from 2809-00004 are supported from PG4UW software version 3.76
  • made in Slovakia
Ord. no. 70-2809
Socket ZIF BGA80, OpenTop type
Bottom 4x25 pins, square, 0.6x0.6mm
Class BGA
Subclass BGA-Top
70-2809

Adapter manual

  • Protect the contacts of adapter connectors and ZIF socket from contamination. Any dirt and/or fat on contacts may cause errors during programming.
  • Usage of vacuum pick-up tool is expected for device handling.
  • Proceed with care! Incorrect insertion of adapter in programmer ZIF socket or device in adapter ZIF socket may lead to programmed device damage.
  • For work with BGA device it is necessary put together BGA-Top-X with some BGA-Bottom-X board according to the information provided by PG4UW software for each particular device (menu Device/ Device info).
  • The picture shows, how to put together the BGA-Top-X and BGA-Bottom-X board to have complete BGA adapter.
  • Insert complete adapter into programmer ZIF socket. If you are in doubts about orientation of the adapter in programmer ZIF socket, there is a rule of thumb - orientation of adapter name text is the same as orientation of the text on the top of programmer.
  • Visually check the placement of adapter in programmer ZIF socket.
  • Push the cover of adapter ZIF socket (the topmost movable part) to open the socket. Once fully actuated, drop the device into the socket from a height of 2 to 3mm above the seating plane. For correct device orientation, follow the instructions shown on picture in PG4UW software Device info window for device being programmed. Then release adapter ZIF socket.
  • The cover must be fully actuated (depressed) before inserting a device into the socket.
  • Do not press on device while inserting it and/or releasing the cover.
  • Visually check the placement of programmed device in adapter ZIF socket. If everything looks OK, the device is ready for programming.
  • To take out the device from adapter, push the cover of adapter ZIF socket and remove the device.
  • When you finish the work with adapter, remove it from programmer ZIF socket.
  • Operating conditions: temperature 5°C ÷ 40°C (41°F ÷ 104°F), humidity 20% ÷ 80% non-condensing.

Software note

  • If software version, you're using currently, doesn't contain support for this programming module, please download the latest version of software - Regular or OnDemand - from our web site.
 

Accepted package(s)

BGA package Package
Design
NAMESYMBOLMINNOMMAX
ProfileA--1.4
Ball HeightA10.4--
Body ThicknessA20.6--
Ball Diameterb0.50.60.7
Body SizeD-13-
Body SizeE-11-
Ball Pitche-1-
Ball Array DGD-8-
Ball Array EGE-8-
NAMESYMBOLMINNOMMAX
ProfileA1.11.21.3
Ball HeightA10.450.50.55
Body ThicknessA2---
Ball Diameterb-0.6-
Body SizeD12.91313.1
Body SizeE10.91111.1
Ball Pitche-1-
Ball Array DGD-8-
Ball Array EGE-8-
NAMESYMBOLMINNOMMAX
ProfileA--1.4
Ball HeightA10.430.480.53
Body ThicknessA2-0.8-
Ball Diameterb0.55-0.65
Body SizeD12.91313.1
Body SizeE10.91111.1
Ball Pitche-1-
Ball Array DGD-8-
Ball Array EGE-8-
NAMESYMBOLMINNOMMAX
ProfileA--1.4
Ball HeightA10.40.50.6
Body ThicknessA20.60.660.76
Ball Diameterb0.50.60.7
Body SizeD12.91313.1
Body SizeE10.91111.1
Ball Pitche-1-
Ball Array DGD-8-
Ball Array EGE-8-
NAMESYMBOLMINNOMMAX
ProfileA--1.4
Ball HeightA10.40.50.6
Body ThicknessA20.65--
Ball Diameterb0.50.60.7
Body SizeD12.91313.1
Body SizeE10.91111.1
Ball Pitche-1-
Ball Array DGD-8-
Ball Array EGE-8-
NAMESYMBOLMINNOMMAX
ProfileA--1.4
Ball HeightA10.40.49-
Body ThicknessA2-0.8-
Ball Diameterb0.550.60.65
Body SizeD12.91313.1
Body SizeE10.91111.1
Ball Pitche-1-
Ball Array DGD-8-
Ball Array EGE-8-
NAMESYMBOLMINNOMMAX
ProfileA1.11.21.3
Ball HeightA10.450.50.55
Body ThicknessA2---
Ball Diameterb0.570.620.67
Body SizeD12.91313.1
Body SizeE10.91111.1
Ball Pitche-1-
Ball Array DGD-8-
Ball Array EGE-8-
NAMESYMBOLMINNOMMAX
ProfileA--1.4
Ball HeightA10.40.49-
Body ThicknessA2-0.8-
Ball Diameterb0.50.55-
Body SizeD12.91313.1
Body SizeE10.91111.1
Ball Pitche-1-
Ball Array DGD-8-
Ball Array EGE-8-
NAMESYMBOLMINNOMMAX
ProfileA--1.4
Ball HeightA10.40.49-
Body ThicknessA20.65--
Ball Diameterb0.450.550.65
Body SizeD12.91313.1
Body SizeE10.91111.1
Ball Pitche-1-
Ball Array DGD-8-
Ball Array EGE-8-

Usable for programmer(s):

BeeHive208S BeeHive204 BeeProg2 BeeProg2C
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