BeeProg2

 
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WARNING: BGA-Bottom-259 [70-2517] is discontinued product! Please go to discontinued products section to find the replacement.

  • 70-2517

  • bottom board of BGA adapters, assigned for Actel ProASICplus devices in matrix 16x16
  • made in Slovakia
Ord. no. 70-2517
Connection to BGA-Top-X 8x25 + 3x20 sockets for wire wrap pin
Bottom 2x24 pins, square, 0.6x0.6mm, rows spacing 600mil
Class BGA/LGA
Subclass BGA-Bottom
Adapter manual
  • For work with BGA device it is necessary put together BGA-Bottom-259 with some BGA-Top-X ZIF-CS board according the information provided by PG4UW software.
  • Do not directly touch the pins of the adapter, because dirt may cause errors during programming of device.
  • The picture show, how to put together the BGA-Top-X ZIF-CS and BGA-Bottom-X boards to have complete BGA adapter.
  • Operation conditions: operating temperature 5°C ÷ 40°C (41°F ÷ 104°F), operating humidity 20%..80%, non condensing.

Software note
  • If software version, you're using currently, doesn't contain support for this programming adapter, please download the latest version of software - Regular or OnDemand - from our web site.
 




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Universal

Specialized for

BGA/LGA

exhibitions

okraj

NEPCON China 2017

25th - 27th Apr 2017
Shanghai World Expo Exhibition & Convention Center
hall no.: Hall 1
booth no.: 1N07
exhibitor: Programtek

Del Mar Electronics Fair

3rd - 4th May 2017
Del Mar Fairgrounds, San Diego, CA, USA
booth no.: Booth #5
exhibitor: BK Precision

All exhibitions »